Patents by Inventor Erqiang Chen

Erqiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer films and laminates containing slip agents
    Patent number: 11338563
    Abstract: Provided is a coextruded multilayer film. The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C. The second layer contains a second ethylene-based polymer. Also provided is a laminate containing said sealant layer.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: May 24, 2022
    Assignee: Dow Global Technologies LLC
    Inventors: Fengyi Su, Andong Liu, Hongyu Chen, Jianping Pan, Xiao Bing Yun, Thomas Allgeuer, Erqiang Chen, Tipeng Zhao, Guihong Liao
  • Multilayer films and laminates containing slip agents
    Patent number: 11090852
    Abstract: The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a saturated primary fatty acid amide having a melting point greater than 100° C. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6. The second layer contains a second ethylene-based polymer. The present disclosure also provides a laminate containing said sealant layer.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: August 17, 2021
    Assignee: Dow Global Technologies LLC
    Inventors: Fengyi Su, Andong Liu, Hongyu Chen, Jianping Pan, Xiao Bing Yun, Thomas Allgeuer, Erqiang Chen, Tipeng Zhao, Guihong Liao
  • Multilayer Films and Laminates Containing Slip Agents
    Publication number: 20210187812
    Abstract: The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a saturated primary fatty acid amide having a melting point greater than 100° C. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6. The second layer contains a second ethylene-based polymer. The present disclosure also provides a laminate containing said sealant layer.
    Type: Application
    Filed: June 9, 2017
    Publication date: June 24, 2021
    Inventors: Fengyi Su, Andong Liu, Hongyu Chen, Jianping Pan, Xiao Bing Yun, Thomas Allgeuer, Erqiang Chen, Tipeng Zhao, Guihong Liao
  • Multilayer Films and Laminates Containing Slip Agents
    Publication number: 20210078315
    Abstract: Provided is a coextruded multilayer film. The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C. The second layer contains a second ethylene-based polymer. Also provided is a laminate containing said sealant layer.
    Type: Application
    Filed: June 9, 2017
    Publication date: March 18, 2021
    Inventors: Fengyi Su, Andong Liu, Hongyu Chen, Jianping Pan, Xiao Bing Yun, Thomas Allgeuer, Erqiang Chen, Tipeng Zhao, Guihong Liao