Patents by Inventor Ertle Werner

Ertle Werner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer with electrically connected contact and test areas
    Patent number: 8753901
    Abstract: The invention relates to an arrangement of contact areas and test areas on patterned semiconductor chips. The contact areas and the test areas are electrically connected to one another via a conduction web. Whereas the contact areas are arranged in a first region, which has no components of an integrated circuit, the test areas lie in a second region of the top side of the semiconductor chip, which region has components of an integrated circuit.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: June 17, 2014
    Assignee: Infineon Technologies AG
    Inventors: Ertle Werner, Bernd Goller, Michael Horn, Bernd Kothe