Abstract: A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Abstract: The present disclosure relates to a lighting component which may comprise a light emitting diode (LED) or laser diode (LD) for generating at least one of blue light or ultraviolet light. A fluoride phosphor matrix may be included, which may be consolidated into a phosphor ceramic structure including at least one of a transparent fluoride ceramic structure or a translucent fluoride ceramic structure, and positioned adjacent to the LED or LD. The phosphor ceramic structure generates at least one of red or orange light when irradiated by the light emitted from the LED or LD. The phosphor ceramic structure exhibits reduced thermal quenching relative to a fluoride particulate structure irradiated by the LED or LD.

Abstract: A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Abstract: A semiconductor chip comprises a substrate, a die attach material, and a die. The substrate comprises an upper surface and a lower surface opposing the upper surface. The die attach material is on the upper surface of the substrate. The die comprises a bottom surface bonded to the upper surface of the substrate by the die attach material, a top surface opposing the bottom surface, and a side wall adjacent to the top surface and the bottom surface. A shortest distance across an exterior of the side wall from the bottom surface to the top surface defines an exterior surface distance. The die further comprises a die height measured from where the side wall meets the bottom surface to where the side wall meets the top surface. The exterior surface distance is longer than the die height.

Abstract: A lighting device is presented. The lighting device includes an LED light source; and a red/far-red emitting phosphor radiationally coupled to the LED light source, wherein the red/far-red emitting phosphor comprises a host material activated with an activator ion, and wherein the activator ion comprises at least one of Sm2+ and Mn2+. Numerous other aspects are provided.

Abstract: A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Abstract: A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Abstract: A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Abstract: A coated phosphors that include a shell comprising a first Mn4+ doped phosphor of formula I Ax[MFy]:Mn4+??I directly disposed on a core comprising a second phosphor. The second phosphor is a material other than a compound of formula I or formula II Ax[MFy]??II wherein A is, independently at each occurrence, Li, Na, K, Rb, Cs, or a combination thereof; M is, independently at each occurrence, Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the [MFy] ion; and y is 5, 6 or 7.

Abstract: The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module, configured to generate a visible light such as white light, and at least one component such as optical component comprising a compound consisting essentially of the elements neodymium (Nd) and fluorine (F), and optionally including one or more other elements. The lighting apparatus is configured to provide a desired light spectrum by filtering the generated visible light using the compound. The at least one component can comprise a NdFxOy compound with values of x and y determining a content ratio F/O, which may be adjusted during manufacturing of the NdFxOy compound to provide desired output light parameters of the apparatus including at least a desired output light spectrum realized by filtering the generated visible light using the NdFxOy compound.

Abstract: A device comprises a base, a die, leads, and an electrically-insulating die housing covering the die. The base comprises a die mounting section in which the die is mounted. The leads extend away from the die mounting section and are electrically connected to the die. The base further comprises a base mounting section and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises a first side, a second side opposing the first side, and a thickness measured between the first and second sides. The thickness of the base throughout the recessed section is less than the thickness of the base throughout the base mounting section. The base further comprises an opening extending at least through the base mounting section from the first side to the second side.

Abstract: A method includes mixing a first fluoride phosphor powder that is doped with tetravalent manganese with a treatment solution for a designated period of time, stopping the mixing to allow the fluoride phosphor powder to settle, removing at least some liquid that has separated from the first fluoride phosphor powder, repeating (a) the mixing, (b) the stopping of the mixing, and (c) removing at least some of the liquid during one or more additional cycles, and obtaining a second fluoride phosphor powder following the repeating of the mixing, the stopping of the mixing, and the removing of at least some of the liquid. The second fluoride phosphor powder includes a reduced amount of the manganese relative to the first fluoride phosphor powder.

Abstract: The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module, configured to generate a visible light such as white light, and at least one component such as optical component comprising a compound consisting essentially of the elements neodymium (Nd) and fluorine (F), and optionally including one or more other elements. The lighting apparatus is configured to provide a desired light spectrum by filtering the generated visible light using the compound. The at least one component can comprise a NdFxOy compound with values of x and y determining a content ratio F/O, which may be adjusted during manufacturing of the NdFxOy compound to provide desired output light parameters of the apparatus including at least a desired output light spectrum realized by filtering the generated visible light using the NdFxOy compound.

Abstract: A device comprises a base, a die, leads, and an electrically-insulating die housing covering the die. The base comprises a die mounting section in which the die is mounted. The leads extend away from the die mounting section and are electrically connected to the die. The base further comprises a base mounting section and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises a first side, a second side opposing the first side, and a thickness measured between the first and second sides. The thickness of the base throughout the recessed section is less than the thickness of the base throughout the base mounting section. The base further comprises an opening extending at least through the base mounting section from the first side to the second side.

Abstract: A lighting device is presented. The lighting device includes an LED light source; and a red/far-red emitting phosphor radiationally coupled to the LED light source, wherein the red/far-red emitting phosphor comprises a host material activated with an activator ion, and wherein the activator ion comprises at least one of Sm2+ and Mn2+. Numerous other aspects are provided.

Abstract: The base of an integrated circuit package comprises a first side, and a second side opposing the first side. The base further comprises, a base mounting section, a die mounting section, and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises an opening extending through the base from the first side to the second side. At least a portion of the recess intersects with the opening.

Abstract: The base of an integrated circuit package comprises a first side, and a second side opposing the first side. The base further comprises, a base mounting section, a die mounting section, and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises an opening extending through the base from the first side to the second side. At least a portion of the recess intersects with the opening.

Abstract: The present disclosure relates to a lighting component which may comprise a light emitting diode (LED) or laser diode (LD) for generating at least one of blue light or ultraviolet light. A fluoride phosphor matrix may be included, which may be consolidated into a phosphor ceramic structure including at least one of a transparent fluoride ceramic structure or a translucent fluoride ceramic structure, and positioned adjacent to the LED or LD. The phosphor ceramic structure generates at least one of red or orange light when irradiated by the light emitted from the LED or LD. The phosphor ceramic structure exhibits reduced thermal quenching relative to a fluoride particulate structure irradiated by the LED or LD.

Abstract: The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module, configured to generate a visible light such as white light, and at least one component such as optical component comprising a compound consisting essentially of the elements neodymium (Nd) and fluorine (F), and optionally including one or more other elements. The lighting apparatus is configured to provide a desired light spectrum by filtering the generated visible light using the compound. The at least one component can comprise a NdFxOy compound with values of x and y determining a content ratio F/O, which may be adjusted during manufacturing of the NdFxOy compound to provide desired output light parameters of the apparatus including at least a desired output light spectrum realized by filtering the generated visible light using the NdFxOy compound.

Abstract: A method includes obtaining particles of a phosphor precursor of formula Ax[MFy]:Mn4+, reducing sizes of the particles of the phosphor precursor by wet milling the particles and annealing the particles that are wet milled by contacting the particles with a fluorine-containing oxidizing agent. Additionally, a manganese doped complex fluoride phosphor prepared by this method is provided. A lighting apparatus and backlight device that include manganese-doped phosphor prepared by this method also are provided.