Patents by Inventor Erwin Eibl

Erwin Eibl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4969066
    Abstract: An electronic module includes two printed-circuit boards which are equipped with hybrid assemblies. The electronic module takes up only a small amount of space and, at the same time, efficiently dissipates the heat loss caused by the hybrid assemblies. The hybrid assemblies are arranged in such a manner that they can be interspersed with one another, similar to a sandwich-type construction. The interspersing provides duct-type, perpendicularly aligned interspaces between the hybrid assemblies, allowing the heat loss to be dissipated in a chimney-like fashion.
    Type: Grant
    Filed: June 30, 1989
    Date of Patent: November 6, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventors: Erwin Eibl, Heinz Schmidt, Heribert Rester