Abstract: A method and a device for producing an aspiration surface on an object, preferably an electrical component intended for the SMD mounting technique. The planar aspiration surface is formed on the surface located opposite the mounting side of the component by applying an adhesive mass onto the component and molding the mass through cover band arranged above the component with a die to shape the adhesive mass into a planar surface. Following curing of the adhesive mass, the cover band is separated from the mass, resulting in a component with a planar aspiration surface for reliable and unproblematic aspiration, pick-up and transport. The adhesive mass may consist of a liquefiable or volatilizable material such as wax, colophonium or plastic.