Patents by Inventor Erwin Ian V. Almagro

Erwin Ian V. Almagro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for connecting a die attach pad to a lead frame and product thereof
    Patent number: 8110492
    Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: February 7, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Erwin Ian V. Almagro, Honorio T. Granada, Jr., Paul Armand Calo
  • METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT THEREOF
    Publication number: 20100304534
    Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
    Type: Application
    Filed: August 13, 2010
    Publication date: December 2, 2010
    Inventors: Erwin Ian V. Almagro, Honorio T. Granada, JR., Paul Armand Calo
  • Method for connecting a die attach pad to a lead frame and product thereof
    Patent number: 7800207
    Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: September 21, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Erwin Ian V. Almagro, Honorio T. Granada, Jr., Paul Armand Calo
  • Wireless semiconductor package for efficient heat dissipation
    Patent number: 7586179
    Abstract: Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: September 8, 2009
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Paul Armand Calo, Margie T. Rios, Tiburcio A. Maldo, JoonSeo Son, Erwin Ian V. Almagro
  • METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT THEREOF
    Publication number: 20090102031
    Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
    Type: Application
    Filed: October 17, 2007
    Publication date: April 23, 2009
    Inventors: Erwin Ian V. Almagro, Honorio T. Granada, JR., Paul Armand Calo