Abstract: Hollow cylindrical blanks of tubular stock are transformed into finished work pieces (3) in a single work stroke with a profiling tool (7) equipped with profiling rollers (30) in one tool section (8) and a die matrix (15) in another tool section (6). The two tool sections (6, 8) are coaxially movable relative to each other, for example by a press. Each profiling roller in the one tool section is rotatably mounted in a chamber and all rollers (30) are positioned circularly around a central longitudinal tool axis (34) so that a central plane of each roller extends substantially radially relative to the tool axis. The die matrix (15) in the other tool section (6) is supported on a central mandrel or arbor (14) that also supports the blank. The die matrix (15) has in its outer surface a plurality of grooves (15A) and ridges (15B) that cooperate with grooves and ridges in the profiling rollers.

Abstract: Hollow cylindrical blanks of tubular stock are transformed into finished work pieces (3) in a single work stroke with a profiling tool (7) equipped with profiling rollers (30) in one tool section (8) and a die matrix (15) in another tool section (6). The two tool sections (6, 8) are coaxially movable relative to each other, for example by a press. Each profiling roller in the one tool section is rotatably mounted in a chamber and all rollers (30) are positioned circularly around a central longitudinal tool axis (34) so that a central plane of each roller extends substantially radially relative to the tool axis. The die matrix (15) in the other tool section (6) is supported on a central mandrel or arbor (14) that also supports the blank. The die matrix (15) has in its outer surface a plurality of grooves (15A) and ridges (15B) that cooperate with grooves and ridges in the profiling rollers.

Abstract: A device for non-cutting manufacturing of an annular part having external teeth includes a core tool that supports the blank from which the annular part is manufactured and is axially displaceable between two profiling rollers arranged diametrically opposite each other, and a separate rotating drive for each of the core tool and the two profiled rollers. The device further includes a computer element which controls the three rotating drives for synchronizing rotational speeds of the core tool and the two profiling rollers. The computer element also controls radial adjustment of the two rollers with their respective full-height regions with respect to the core tool by a calibration amount at the conclusion of the shaping operation.

Abstract: In the disclosed can-type evaporative cooling device for power semiconductor elements, the semiconductor elements (1) are stacked, in disk cell construction, alternately with cooling cans (2) to form a column having a conjoint clamping device (10). The cooling cans (2) have evaporator cavities for receiving an electrically insulating cooling liquid which evaporates when the semiconductor elements (1) are in operation. A closed coolant circuit between the cooling cans (2) and a conjoint recooler, via pipelines, results. For electrical separation of the electrically live cooling cans (2) from one another and from the recooler, electrically insulating horizontal vapor collecting lines (20) and condensate collecting lines (21) are provided to each of which are connected vertical vapor lines (7) and condensate lines (23), respectively, for the individual cooling cans (2). The condensate lines (21, 23) are each accommodated in the corresponding vapor lines (7, 20).

Abstract: Cooling device for semiconductor components, including a chamber for receiving semiconductor components, boiling liquid disposed in the chamber for immersing the semiconductor components, a device connected to the chamber for supplying a cooling air to eliminate a temperature rise of the boiling liquid and to remove a maximum power loss at a normal maximum ambient temperature, a thermal energy accumulator connected to the chamber, and a device for switching off the cooling air supply device and switching on the thermal energy accumulator if the ambient temperature of the cooling air rises.

Abstract: A power semiconductor component for liquid cooling, includes a semiconductor crystal disc which has at least one pn-junction and two main electrodes which are connected through thermally and electrically conducting multicontacts to thermally and electrically conducting heat sink discs. Together with a circular ceramic ring and further ring-shaped parts, the heat sink discs form a liquid-tight housing around which a cooling liquid can flow. The heat sink discs form the bottom of cooling capsules with a wall, a cover and cooling rods in the interior of the capsules, through which the coolant can flow. The cooling capsules are provided with openings for feeding in and discharging the coolant. The covers of the cooling capsule are provided with electrical connecting eyes. Two half-shells with hydraulic connecting eyes are provided as an outer insulating housing, having a multibranch canal system from holes formed in the connecting eyes of the half-shells to the cooling capsule openings.

Abstract: A power semiconductor component is used for boiling cooling of a power semiconductor crystal disc having two main electrodes, and optionally one or more control electrodes. Two multicontacts are provided, each being electrically connected to a respective one of the main electrodes for thermal and mechanical relief. Two heat sinks are provided, each being in electrical and thermal contact with a respective one of the multicontacts. Connecting eyes are integral with the heat sinks for electrically connecting the main electrodes. A liquid and gas-tight housing surrounds the semiconductor crystal disc, the housing including a ceramic sleeve having a boiling liquid space formed therein and metallic covers disposed laterally on the ceramic sleeve, the connecting eyes protrude through and are connected to the metallic covers, and an insulating sleeve is molded around the housing.

Abstract: A power semiconductor component for boiling cooling or liquid cooling includes a semiconductor crystal disc having two main electrodes and, optionally, one or more control electrodes. The disc is built into a liquid and gas-tight housing through which an electrically insulating coolant can flow. The housing is formed substantially of a ceramic sleeve with metallic covers which are disposed on both sides and the metallic covers are directly acted upon by the coolant. Electric circuitry, especially resistors and diodes, are integrated in a circuitry module which is in force-locking thermal contact with the metallic cover of the power semiconductor component.

Abstract: A cooling system for cooling at least one semiconductor component, including a convection heat exchanger thermally coupled to the component and a refrigeration cycle thermally coupled to the heat exchanger and including a compressor, a condenser, a collector, an expansion valve and an evaporator. The evaporator is coupled in series with the heat exchanger to form a coolant cycle for recooling of the coolant. At least one fan is provided for forcibly ventilating the convection heat exchanger. The condenser of the refrigeration cycle is installed in the heat exchanger whereby the fan serves also to cool the condenser. A coolant, in particular trifluortrichlorethane (C.sub.2 F.sub.3 Cl.sub.3), having a boiling point below the wall temperature of the semiconductor component being cooled is used.

Abstract: A cooling container for liquid-cooled semiconductor construction elements wherein pegs are located in the interior of the container in the flow path of the cooling liquid and arranged vertically to the floors of the container and connected with these floors so that they are tight in regard to their material. Preferably, these pegs have a square cross-section and with one diagonal are located transversely to the flow direction. In addition, barriers are located at half the distance of flow in the cooling container, which are diametrically opposite for the purpose of narrowing the cross-section of the flow.

Abstract: Cooling device for a liquid-cooled semiconductor power component of the type having a disc cell formed with two main contact surfaces and electrical and thermal pressure-contacting means therefor in an insulating casing, and having means for liquid cooling including cooling capsules through which liquid flows, the cooling capsules being connected by a clamping device to the two main contact surfaces of the disc cell and being selectively coupable through a liquid-conducting support bar to a plurality of semiconductor power components, including insulating screw connections for connecting union pipes and connecting pipes for the coolant to the cooling capsules with an inclusion of at least partly cold-deformable material of the insulating screw connections, the cooling capsules being connected coolant-wise in series, and including expansion bends formed at least in the connecting pipes between the cooling capsules.