Abstract: A stacked die molded leadless package (MLP) stacks two dice and uses leads formed integrally with top and central clips and a leadframe to avoid wire bonding. The central clip leads are source and gate leads leading to source and gate portions of the central clip common to source and gate regions of both dice. The top clip and leadframe are thus connected to the drain regions of the upper and lower dice, the leads of the top clip being drain leads connected to the leadframe leads. The central clip and leadframe leads provide source, gate, and drain terminals in the finished MLP. A method of making the MLP includes flip-chip assembly of the clips, dice, and leadframes in pairs or greater simultaneous quantities. Spacers can be employed between connected components to ensure proper alignment and distribution of bonding material.