Abstract: A method for producing a radiation-emitting device is disclosed. In an embodiment a method includes providing a substrate, applying a first electrode over the substrate, applying a fluorescent compound over the first electrode, wherein the fluorescent compound forms at least a part of a light-emitting layer of a radiation-emitting organic electronic device, and applying a second electrode over the light-emitting layer.

Abstract: A process for producing a silicon-SiC composite powder is provided. A gas stream I containing SiH4, Si2H6 and/or Si3H8 and at least one hydrocarbon of ethene and acetylene and a coaxial gas stream II containing hydrogen are fed into a hot wall reactor. The gas stream II forms the jacket stream with respect to the gas stream I. At least the gas stream I is reacted at a temperature of 900° C. to 1100° C. and subsequently at the outlet of the hot wall reactor the reaction mixture is cooled or allowed to cool and the pulverulent reaction product is separated from the gaseous materials.

Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.

Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.

Abstract: A radiation-emitting organic-electronic device is specified. The radiation-emitting organic-electronic device includes a substrate, a first electrode arranged above the substrate, a light-emitting layer arranged above the first electrode, and a second electrode arranged above the light-emitting layer. The light-emitting layer includes a fluorescent compound of a specified formula A. The spacer comprises a linear molecular chain to which two substituents R and R? are terminally bonded, and at least one group E bonded to the linear molecular chain, wherein E denotes hydrogen and/or an organic radical. The linear molecular chain of the molecules of the fluorescent compound is aligned parallel to the plane of extent of the substrate.

Abstract: An organic light-emitting device and a method for producing an organic light emitting device are disclosed. In an embodiment the device includes a substrate and at least one layer sequence arranged on the substrate and suitable for generating electromagnetic radiation. The at least one layer sequence includes at least one first electrode surface arranged on the substrate, at least one second electrode surface arranged on the first electrode surface and an organic functional layer stack having organic functional layers between the first electrode surface and the second electrode surface. The organic functional layer stack includes at least one organic light-emitting layer, wherein the at least one organic light-emitting layer is configured to emit light, wherein the organic functional layer stack includes at least one inhomogeneity layer, and wherein a thickness of the at least one inhomogeneity layer varies in a lateral direction.

Abstract: A method for producing a bent organic light-emitting diode and a bent organic light-emitting diode are disclosed. In an embodiment the method includes providing an emitter unit having an organic layer sequence for generating radiation, providing at least one electrical connection piece, bending the at least one connection piece and the emitter unit into a curved shape and subsequently mechanically fixedly and permanently connecting the at least one connection piece to the emitter unit so that the curved shape is permanently maintained.

Abstract: The organic light-emitting diode (1) has a first electrode (21) with a first electric conductivity and a second electrode (22) with a second lower electric conductivity. An organic layer stack (4) for generating light is located between the electrodes (21, 22). The light-emitting diode (1) further comprises a current distribution layer (3) with a third high electric conductivity. When seen in a plan view, multiple contact regions (33) are located outside of an outer contour line (40) of the layer stack (4). The second electrode (22) and the current distribution layer (3) contact each other in the contact regions (33). In a current blocking region (34), the current distribution layer (3) is located entirely within the contour line (40) such that the second electrode (22) is electrically disconnected from the current distribution layer (3).

Abstract: An apparatus for chlor-alkali electrolysis, comprising a cathode half-cell, an oxygen-consuming electrode arranged therein, a conduit for supply of gaseous oxygen to the cathode half-cell and a conduit for purging the cathode half-cell with inert gas, enables the flexible use of power by a method in which chlorine is produced in the apparatus by chlor-alkali electrolysis, wherein, when power supply is low, the oxygen-consuming electrode is supplied with gaseous oxygen, and oxygen is reduced at the oxygen-consuming electrode at a first cell voltage, and when power supply is high, the oxygen-consuming electrode is not supplied with any oxygen, and hydrogen is generated at the cathode at a second cell voltage which is higher than the first cell voltage.

Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.

Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.

Abstract: An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface during intended operation of the diode. In a plan view of the luminous surface, the sequence adjoins at least a partial region of substrate edge(s), and in the region the luminous surface extends at least as far as the corresponding edge. An encapsulation formed in an uninterrupted and continuous fashion is applied to the sequence. The encapsulation, at least in the region of the edge adjoining the sequence, is led onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the surface.

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.

Abstract: In one embodiment, the organic light emitting diode (1) comprises a carrier substrate (2) having an organic layer stack for producing light. The organic light emitting diode (1) is electrically connectable via at least one connector (3) as intended. The connector (3) has two main sides (32) situated opposite one another that each have at least two electrical contact pads (31) of the connector (3) located on them. As seen in a cross section perpendicular to the main sides (32) and perpendicular to an insertion direction (x) of the connector (3), the contact pads (31) are arranged both geometrically and with electrical point symmetry, so that incorrect-polarity protection against incorrect electrical connection of the organic light emitting diode (1) is attained.

Abstract: A double-sided emissive organic display device includes a carrier, a control element layer structure above the carrier, a plurality of first organic light emitting components, which are formed above the carrier, which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit first light substantially in a direction toward the carrier, and a plurality of second organic light emitting components, which are formed above the control element layer structure and which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit second light substantially in a direction away from the carrier.

Abstract: A process for producing a silicon-SiC composite powder is provided. A gas stream I containing SiH4, Si2H6 and/or Si3H8 and at least one hydrocarbon of ethene and acetylene and a coaxial gas stream II containing hydrogen are fed into a hot wall reactor. The gas stream II forms the jacket stream with respect to the gas stream I. At least the gas stream I is reacted at a temperature of 900° C. to 1100° C. and subsequently at the outlet of the hot wall reactor the reaction mixture is cooled or allowed to cool and the pulverulent reaction product is separated from the gaseous materials.

Abstract: A method for producing a bent organic light-emitting diode and a bent organic light-emitting diode are disclosed. In an embodiment the method includes providing an emitter unit having an organic layer sequence for generating radiation, providing at least one electrical connection piece, bending the at least one connection piece and the emitter unit into a curved shape and subsequently mechanically fixedly and permanently connecting the at least one connection piece to the emitter unit so that the curved shape is permanently maintained.

Abstract: The invention relates to a process for removal of bromine, bromine- and/or iodine-containing silicon compounds from compositions of chlorosilanes containing bromine, bromine- and/or iodine-containing silicon compounds, wherein the composition is subjected to a nonthermal plasma and subsequently the chlorosilanes may be separated from the bromine- and/or iodine-containing compounds present by distillation.

Abstract: The organic light-emitting diode (1) has a first electrode (21) with a first electric conductivity and a second electrode (22) with a second lower electric conductivity. An organic layer stack (4) for generating light is located between the electrodes (21, 22). The light-emitting diode (1) further comprises a current distribution layer (3) with a third high electric conductivity. When seen in a plan view, multiple contact regions (33) are located outside of an outer contour line (40) of the layer stack (4). The second electrode (22) and the current distribution layer (3) contact each other in the contact regions (33). In a current blocking region (34), the current distribution layer (3) is located entirely within the contour line (40) such that the second electrode (22) is electrically disconnected from the current distribution layer (3).