Abstract: A method for generating a surface that can be bonded with gold wire. The surface is obtained by first depositing an exchange palladium layer made of the electrolyte on conductors of printed circuit boards, in particular on conductors made of copper or conductive paste. The exchange palladium layer is then reinforced with a palladium layer, deposited from a chemical palladium electrolyte. In order to protect the palladium, an exchange gold layer is then applied. An exchange palladium bath is used, comprising an organic brightener.

Abstract: Aqueous solution of monovalent gold and ammonium sulfite complex. As opposed to the corresponding alkali-gold sulfite solution, this solution is stable under slightly acidic pH conditions and can be used advantageously for preparing electrolytic baths for the plating of gold and gold alloys having a great flexibility of use and a particularly long working life. This solution is prepared, in a very economical manner, by adding ammonia to an HAuCl.sub.4 solution which results in the formation of a precipitate, then by dissolving this precipitate in an aqueous ammonium sulfite solution.

Abstract: Disclosed is a bath and process for obtaining deposits of gold or gold alloys of improved uniformity of deposit thickness on an irregularly shaped conductive surface. The aqueous plating bath contains gold as the aurocyanide complex, a mild reducing agent, a complexing agent, arsenic as a water-soluble arsenic compound, and a substituted polyamine.

Abstract: Disclosed is an improved gold-sulfite bath for plating gold and gold alloy deposits. By the inclusion in the bath of small amounts of certain organic phosphorus compounds, the quality of the deposit is rendered less sensitive to substantial changes in operating variables.