Patents by Inventor Erwin REINISCH

Erwin REINISCH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140003632
    Abstract: A microphone arrangement including a stack, the stack further including a MEMS microphone and a MEMS interface. The MEMS microphone includes a semiconductor body having a movable member on a first main surface, and the MEMS interface includes another semiconductor body having contact pads on a second main surface. The MEMS microphone and the MEMS interface are electrically connected via the contact pads with the first main surface facing the second main surface.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 2, 2014
    Applicant: ams AG
    Inventor: Erwin REINISCH