Patents by Inventor Erwin Vogl

Erwin Vogl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices and processing methods
    Patent number: 9455205
    Abstract: A method for processing a semiconductor device in accordance with various embodiments may include: providing a semiconductor device having a first pad and a second pad electrically disconnected from the first pad; applying at least one electrical test potential to at least one of the first pad and the second pad; and electrically connecting the first pad and the second pad to one another after applying the at least one electrical test potential.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: September 27, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Markus Zundel, Franz Hirler, Peter Nelle, Ludger Borucki, Markus Winkler, Erwin Vogl
  • Anchoring Structure and Intermeshing Structure
    Publication number: 20150311163
    Abstract: An anchoring structure for a metal structure of a semiconductor device includes an anchoring recess structure having at least one overhanging side wall, the metal structure being at least partly arranged within the anchoring recess structure.
    Type: Application
    Filed: July 2, 2015
    Publication date: October 29, 2015
    Inventors: Erwin Vogl, Markus Zundel
  • Anchoring structure and intermeshing structure
    Patent number: 9076821
    Abstract: An anchoring structure for a metal structure of a semiconductor device includes an anchoring recess structure having at least one overhanging side wall, the metal structure being at least partly arranged within the anchoring recess structure.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: July 7, 2015
    Assignee: Infineon Technologies AG
    Inventors: Erwin Vogl, Markus Zundel
  • SEMICONDUCTOR DEVICES AND PROCESSING METHODS
    Publication number: 20140097431
    Abstract: A method for processing a semiconductor device in accordance with various embodiments may include: providing a semiconductor device having a first pad and a second pad electrically disconnected from the first pad; applying at least one electrical test potential to at least one of the first pad and the second pad; and electrically connecting the first pad and the second pad to one another after applying the at least one electrical test potential.
    Type: Application
    Filed: October 17, 2013
    Publication date: April 10, 2014
    Applicant: Infineon Technologies AG
    Inventors: Markus Zundel, Franz Hirler, Peter Nelle, Ludger Borucki, Markus Winkler, Erwin Vogl
  • Anchoring Structure and Intermeshing Structure
    Publication number: 20120211891
    Abstract: An anchoring structure for a metal structure of a semiconductor device includes an anchoring recess structure having at least one overhanging side wall, the metal structure being at least partly arranged within the anchoring recess structure.
    Type: Application
    Filed: February 22, 2012
    Publication date: August 23, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Erwin Vogl, Markus Zundel