Abstract: A foil-based package and a method for manufacturing a foil-based package includes, among other things, a first and a second foil substrate. An electronic component is arranged between the two foil substrates in a sandwich-like manner. Due to the component thickness, there is a distance difference between the two foil substrates between the mounting area of the component and ears outside of the mounting area. The foil-based package and the method provides means for reducing and/or compensating a distance difference between the first foil substrate and the second foil substrate caused by the component thickness.

Abstract: The invention relates to a multi-layer 3D foil package and to a method for manufacturing such a multi-layer 3D foil package. The 3D foil package has a foil substrate stack having at least two foil planes, wherein a first electrically insulating foil substrate is arranged in a first foil plane, and wherein a second electrically insulating foil substrate is arranged in a second foil plane, wherein the first foil substrate has a first main surface region on which at least one functional electronic component is arranged, wherein the second foil substrate has a cavity having at least one opening in the second main surface region, wherein the foil substrates within the foil substrate stack are arranged one above the other such that the functional electronic component arranged on the first foil substrate is arranged within the cavity provided in the second foil substrate.

Abstract: The invention relates to a multi-layer 3D foil package and to a method for manufacturing such a multi-layer 3D foil package. The 3D foil package has a foil substrate stack having at least two foil planes, wherein a first electrically insulating foil substrate is arranged in a first foil plane, and wherein a second electrically insulating foil substrate is arranged in a second foil plane, wherein the first foil substrate has a first main surface region on which at least one functional electronic component is arranged, wherein the second foil substrate has a cavity having at least one opening in the second main surface region, wherein the foil substrates within the foil substrate stack are arranged one above the other such that the functional electronic component arranged on the first foil substrate is arranged within the cavity provided in the second foil substrate.

Abstract: A foil-based package and a method for manufacturing a foil-based package includes, among other things, a first and a second foil substrate. An electronic component is arranged between the two foil substrates in a sandwich-like manner. Due to the component thickness, there is a distance difference between the two foil substrates between the mounting area of the component and ears outside of the mounting area. The foil-based package and the method provides means for reducing and/or compensating a distance difference between the first foil substrate and the second foil substrate caused by the component thickness.

Abstract: The present invention relates to a method for the selective coating of a surface of a substrate with liquid, wherein the surface to be selectively coated with liquid comprises regions exhibiting different surface energies, and wherein prior to wetting a fluorine-containing plasma gas is directly acting on the regions exhibiting different surface energies.