Abstract: A bendable display assembly comprises a plurality of layered elements each having two side surfaces, each having an area, the elements comprising a display element capable of displaying an adjustable visual output. Two successive elements of the plurality of layered elements have opposite side surfaces facing towards each other, the opposite side surfaces being, for a majority of their areas, in contact with a sealed sliding fluid volume extending between the successive elements, whereby the successive elements are slidably movable relative to each other when the display assembly is bent.

Abstract: A bendable display assembly comprises a plurality of layered elements each having two side surfaces, each having an area, the elements comprising a display element capable of displaying an adjustable visual output. Two successive elements of the plurality of layered elements have opposite side surfaces facing towards each other, the opposite side surfaces being, for a majority of their areas, in contact with a sealed sliding fluid volume extending between the successive elements, whereby the successive elements are slidably movable relative to each other when the display assembly is bent.

Abstract: A bendable display assembly comprises a plurality of layered elements each having two side surfaces, each having an area, the elements comprising a display element capable of displaying an adjustable visual output. Two successive elements of the plurality of layered elements have opposite side surfaces facing towards each other, the opposite side surfaces being, for a majority of their areas, in contact with a sealed sliding fluid volume extending between the successive elements, whereby the successive elements are slidably movable relative to each other when the display assembly is bent.

Abstract: A bendable display assembly comprises a plurality of layered elements each having two side surfaces, each having an area, the elements comprising a display element capable of displaying an adjustable visual output. Two successive elements of the plurality of layered elements have opposite side surfaces facing towards each other, the opposite side surfaces being, for a majority of their areas, in contact with a sealed sliding fluid volume extending between the successive elements, whereby the successive elements are slidably movable relative to each other when the display assembly is bent.

Abstract: The invention relates to an integrated circuit comprising a top package with a first substrate carrying an integrated circuit, and a bottom package with a second substrate carrying at least one die. To increase the clearance between the top package and the bottom package, the invention provides a cavity within the lower surface of the top package substrate such that at least parts of the die are placed within the cavity when the top package and the bottom package are assembled into a package stack.

Abstract: The invention relates to an integrated circuit comprising a top package with a first substrate carrying an integrated circuit, and a bottom package with a second substrate carrying at least one die. To increase the clearance between the top package and the bottom package, the invention provides a cavity within the lower surface of the top package substrate such that at least parts of the die are placed within the cavity when the top package and the bottom package are assembled into a package stack.

Abstract: An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the interconnections are aligned such that the pattern has substantially rounded or chamfered corners. The present invention provides an improved interconnection life and reliability of ball grid array packages and it is easily implemented.

Abstract: The invention relates to an integrated circuit package, in particular an integrated chip size package or an integrated chip scale package, comprising a substrate carrying a die, and connection elements, interconnection elements, connecting pins of said die with said connection elements, and a mold encapsulating said die on said substrate. To increase reliability and to reduce failure due to deformation stress, the invention provides said mold with reduced stiffness at areas located substantially at one of said interconnection elements providing increased flexibility of said package at said areas compared to other areas of said package.

Abstract: An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the interconnections are aligned such that the pattern has substantially rounded or chamfered corners. The present invention provides an improved interconnection life and reliability of ball grid array packages and it is easily implemented.

Abstract: The invention relates to an integrated circuit package, in particular an integrated chip size package or an integrated chip scale package, comprising a substrate carrying a die, and connection elements, interconnection elements, connecting pins of said die with said connection elements, and a mold encapsulating said die on said substrate. To increase reliability and to reduce failure due to deformation stress, the invention provides said mold with reduced stiffness at areas located substantially at one of said interconnection elements providing increased flexibility of said package at said areas compared to other areas of said package.

Abstract: An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the interconnections are aligned such that the pattern has substantially rounded or chamfered comers. The present invention provides an improved interconnection life and reliability of ball grid array packages and it is easily implemented.

Abstract: An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the interconnections are aligned such that the pattern has substantially rounded or chamfered corners. The present invention provides an improved interconnection life and reliability of ball grid array packages and it is easily implemented.