Patents by Inventor Esteban L. Abadilla

Esteban L. Abadilla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING
    Publication number: 20080272176
    Abstract: In the manufacture of electronic devices (22, 22?), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (20?). Thus, a cost saving is achieved with regard to tool material.
    Type: Application
    Filed: July 11, 2008
    Publication date: November 6, 2008
    Applicant: NXP B.V.
    Inventors: RAMIL N. VASQUEZ, ESTEBAN L. ABADILLA, ALEXANDER M. ROGADO, CRISPULO LICTAO
  • Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding tool
    Patent number: 7413108
    Abstract: In the manufacture of electronic devices (22, 22?), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (20?). Thus, a cost saving is achieved with regard to tool material.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: August 19, 2008
    Assignee: NXP B.V.
    Inventors: Ramil N. Vasquez, Esteban L. Abadilla, Alexander M. Rogado, Crispulo Lictao, Jr.