Abstract: Apparatus and techniques described herein can be used to provide a bipolar battery plate with lower resistance as compared to other approaches. In an example, a bipolar plate comprises a conductive current collector substrate with lead-containing surfaces on both sides, onto which active materials are applied. Interfaces with low contact resistance can be created between the active materials and the current collector substrate by a combination of mechanical, thermochemical, and electrochemical techniques. Specifically, the present subject matter can include a bipolar plate fabricated by applying “wet,” (e.g., uncured) active materials to the current collector, and performing a curing procedure such that a corrosion layer with low contact resistance is formed between the active materials and the underlying surfaces of the current collector.

Abstract: A current collector plate assembly including a polygon-shaped electrically conductive substrate having a first surface and a second, opposing, surface, and at least three edges. A frame is coupled to regions of the first and second surfaces near the at least three edges of the substrate. A first cladding of a positive active materials layer covers an area of the first surface of the substrate. A second cladding of a negative active materials layer covers an area of the second surface of the substrate.

Abstract: A conductive current collector with modified surfaces can be included as a portion of a bipolar battery assembly. The fabrication process can include deposition or formation of a thin film layer such as metal silicide on a surface of the current collector. Metal silicides can be created by co-sputtering or by annealing after deposition of one or more of a silicon or a metal layer. Additional layers can be provided, such as to facilitate adhesion of an active material to a current collector.

Abstract: A current collector assembly, such as for a bipolar lead acid battery, can include an electrically-conductive silicon substrate and a frame bonded to the electrically-conductive silicon substrate. The substrate can be treated or modified, such as to include one or more thin films which render a surface substrate electrically conductive and electrochemically stable in the presence of a lead acid electrolyte chemistry. An interface between the frame and the electrically-conductive silicon substrate can be hermetically sealed. In an example, the frame can provide an edge-seal ring configuration. In an example, a casing assembly can include a spacer bonded to the substrate, along with a casing segment and a thermally-conductive rib, the spacer isolating the thermally-conductive rib from the electrically-conductive silicon substrate electrically.

Abstract: A current collector assembly, such as for a bipolar lead acid battery, can include an electrically-conductive silicon substrate and a frame bonded to the electrically-conductive silicon substrate. The substrate can be treated or modified, such as to include one or more thin films which render a surface substrate electrically conductive and electrochemically stable in the presence of a lead acid electrolyte chemistry. An interface between the frame and the electrically-conductive silicon substrate can be hermetically sealed. In an example, the frame can provide an edge-seal ring configuration. In an example, a casing assembly can include a spacer bonded to the substrate, along with a casing segment and a thermally-conductive rib, the spacer isolating the thermally-conductive rib from the electrically-conductive silicon substrate electrically.