Patents by Inventor Ethan Berkowitz

Ethan Berkowitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250095201
    Abstract: A method includes retrieving a plurality of images containing one or more objects of interest and generating, with one or more processors, using a machine learning model, a bounding box around each of the one or more objects of interest for each of the plurality of images. The method also includes determining, with the one or more processors, a geographical position of each of the one or more objects of interest based on a position of the bounding box.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 20, 2025
    Inventors: Ori Shental, Ashwin Sampath, Michael Dimare, Junyi Li, Thomas Joseph Richardson, Muhammad Nazmul Islam, Michael Ethan Berkowitz
  • Publication number: 20240146449
    Abstract: Apparatus, methods, and computer-readable media for facilitating distribution matching via reversed compression are disclosed herein. An example method for wireless communication at a wireless transmitter includes decompressing a first sequence of information bits for wireless transmission to output a sequence of shaped symbols. The example method also includes compressing the sequence of shaped symbols to output a second sequence of compressed information bits. The example method also includes transmitting, to a receiver, a signal comprising the sequence of shaped symbols.
    Type: Application
    Filed: April 16, 2021
    Publication date: May 2, 2024
    Inventors: Ori SHENTAL, Thomas Joseph RICHARDSON, Liangming WU, Kexin XIAO, Ashwin SAMPATH, Muhammad Nazmul ISLAM, Michael DIMARE, Michael Ethan BERKOWITZ, Changlong XU, Hao XU
  • Patent number: 10892574
    Abstract: A cable to board interconnect device that is used to interconnect wires to a printed circuit board (PCB) that has conductive traces on its essentially flat surface, where the wires are essentially parallel to the face of the PCB. The device includes an alignment member that overlies the wires, and an elastomeric conductor between the wires and the PCB traces.
    Type: Grant
    Filed: October 21, 2017
    Date of Patent: January 12, 2021
    Assignee: Paricon Technologies Corporation
    Inventors: Roger Weiss, Everett Simons, William Petrocelli, Ethan Berkowitz
  • Publication number: 20200067215
    Abstract: A cable to board interconnect device that is used to interconnect wires to a printed circuit board (PCB) that has conductive traces on its essentially flat surface, where the wires are essentially parallel to the face of the PCB. The device includes an alignment member that overlies the wires, and an elastomeric conductor between the wires and the PCB traces.
    Type: Application
    Filed: October 21, 2017
    Publication date: February 27, 2020
    Inventors: Roger Weiss, Everett Simons, William Petrocelli, Ethan Berkowitz