Abstract: A cover assembly for a socket suitable to accommodate modules of varying thicknesses which can be advantageously used for final test and burn-in test is described. The assembly is characterized by having a low profile and includes a hinged lid; a floating shaft coupled to two cams pivoting on the floating shaft; a locking member positioned between the two cams for locking the hinged lid when in a closed position, the locking member pivoting about the floating shaft; a pressure plate for forcing the module into the socket; and stiffening members integral to the hinged lid located on opposing sides of the hinged lid and below the surface of the pressure plate for providing added strength to the assembly. The assembly also includes a heatsink inserted through an aperture located in the pressure plate, to directly contact the chip which is mounted on the module. The force applied to the chip is independent of the force applied to the module.