Abstract: A flip-flop circuit comprises a pass gate, a feedback inverter, and an interleaved filter. The pass gate comprises a clock input and an inverting clock input. The feedback inverter includes a feedback input coupled to both the clock input and the inverting clock input of the pass gate. The interleaved filter comprises a delay circuit including a delay output, a C-gate element, and a blocking inverter. The C-gate element includes a C-gate input and a C-gate output. The C-gate input is coupled to the delay output of the delay circuit and the pass gate, and the C-gate output is coupled to the feedback input of the feedback inverter. The blocking inverter includes a blocking input and a blocking output. The blocking input is coupled to the delay output of the delay circuit, and the blocking output is coupled to the feedback input of the feedback inverter.

Abstract: A flip-flop circuit comprises a pass gate, a feedback inverter, and an interleaved filter. The pass gate comprises a clock input and an inverting clock input. The feedback inverter includes a feedback input coupled to both the clock input and the inverting clock input of the pass gate. The interleaved filter comprises a delay circuit including a delay output, a C-gate element, and a blocking inverter. The C-gate element includes a C-gate input and a C-gate output. The C-gate input is coupled to the delay output of the delay circuit and the pass gate, and the C-gate output is coupled to the feedback input of the feedback inverter. The blocking inverter includes a blocking input and a blocking output. The blocking input is coupled to the delay output of the delay circuit, and the blocking output is coupled to the feedback input of the feedback inverter.

Abstract: A test structure for measuring static noise margin (SNM) for one or more static random access memory (SRAM) cells can include a first transistor gate (TG) and a second TG electrically coupled to each SRAM cell. In an implementation, an interconnect between an output of a first inverter and an input of a second inverter of the SRAM cell can be electrically disconnected using a cut off. During operation of the SRAM cell, internal storage nodes within the SRAM cell can be electrically coupled through the first TG and the second TG to, for example, external pins and to a test fixture. Electrical parameters such as voltage can be measured at the internal storage nodes through the external pins and used to calculate SNM of the SRAM cell.

Abstract: A test structure for measuring static noise margin (SNM) for one or more static random access memory (SRAM) cells can include a first transistor gate (TG) and a second TG electrically coupled to each SRAM cell. In an implementation, an interconnect between an output of a first inverter and an input of a second inverter of the SRAM cell can be electrically disconnected using a cut off. During operation of the SRAM cell, internal storage nodes within the SRAM cell can be electrically coupled through the first TG and the second TG to, for example, external pins and to a test fixture. Electrical parameters such as voltage can be measured at the internal storage nodes through the external pins and used to calculate SNM of the SRAM cell.

Abstract: Systems and methods to ensure correct operation of a semiconductor chip in the presence of ionizing radiation is disclosed. The system includes a semiconductor chip, a first radiation detection array incorporated in the semiconductor chip, and at least one additional radiation detection array incorporated in the semiconductor chip. a processor determines a region of the semiconductor chip affected by an incident radiation particle by analyzing a trajectory of the radiation particle determined from locations of sensors hit by the radiation particle in the first radiation detection array and the at least one additional radiation detection array. The processor determines whether corrective action is needed based on the region of the semiconductor chip affected by the incident radiation particle.

Abstract: Each one of a pair of CMOS transistors is formed in its own island and a gate terminal for each transistor is formed by a single, in-line conductor connecting both gate terminals together. This type of “in-line” connection achieves nearly a five-time improvement in the reduction of the ability of ionizing radiation particles to strike both transistors at the same time as compared to prior art “side-by-side” transistor stacking through use of a relatively smaller solid angle spanning the two transistors. This results in “hardening” of the transistors and improving their resistance to single event upsets and, thus, improving the soft error rate (SER) of the transistors.

Abstract: An array of radiation sensors or detectors is integrated within a three-dimensional semiconductor IC. The sensor array is located relatively close to the device layer of a circuit (e.g., a microprocessor) to be protected from the adverse effects of the ionizing radiation particles. As such, the location where the radiation particles intersect the device layer can be calculated with coarse precision (e.g., to within 10 s of microns).

Abstract: Systems and methods to ensure correct operation of a semiconductor chip in the presence of ionizing radiation is disclosed. The system includes a semiconductor chip, a first radiation detection array incorporated in the semiconductor chip, and at least one additional radiation detection array incorporated in the semiconductor chip. a processor determines a region of the semiconductor chip affected by an incident radiation particle by analyzing a trajectory of the radiation particle determined from locations of sensors hit by the radiation particle in the first radiation detection array and the at least one additional radiation detection array. The processor determines whether corrective action is needed based on the region of the semiconductor chip affected by the incident radiation particle.

Abstract: A method of determining one or more transistors within a particular circuit to be respectively replaced with a hardened transistor includes: identifying, as not requiring hardening, one or more transistors; identifying, as candidates for hardening, each transistor in the circuit not previously identified as not requiring hardening; and employing the hardened transistor in place of a transistor identified as a candidate for hardening. The circuit is a latch and the transistor is an SOI CMOS FET. The transistor is also an SOI transistor. The series transistor includes first and second series-connected transistors having a shared source/drain region whereby a drain of the first series-connected transistor is merged with a source of the second series-connected transistor.

Abstract: A digital logic storage structure includes cross coupled first and second complementary metal oxide semiconductor (CMOS) inverters formed on a semiconductor substrate, the CMOS inverters including a first storage node and a second storage node that is the logical complement of the first storage node; both of the first and second storage nodes each selectively coupled to a deep trench capacitor through a switching transistor, with the switching transistors controlled by a common capacitance switch line coupled to gate conductors thereof; wherein, in a first mode of operation, the switching transistors are rendered nonconductive so as to isolate the deep trench capacitors from the inverter storage nodes and, in a second mode of operation, the switching transistors are rendered conductive so as to couple the deep trench capacitors to their respective storage nodes, thereby providing increased resistance of the storage nodes to single event upsets (SEUs).

Abstract: The different advantageous embodiments provide an integrated circuit comprising a number of latches and a number of filters. Each latch in the number of latches has a plurality of inputs and a plurality of storage nodes. The plurality of storage nodes includes a number of pairs of circuit nodes that form a number of upsettable circuit node pairs. Each input of the plurality of inputs is connected to a corresponding storage node in the plurality of storage nodes. Each filter in the number of filters has an input and a plurality of outputs. Each of the plurality of outputs is connected to a corresponding input of the plurality of inputs of a latch in the number of latches. Each filter in the number of filters is located between two circuit nodes forming an upsettable circuit node pair of the latch in the number of latches to increase critical node spacing.

Abstract: An array of radiation sensors or detectors is integrated within a three-dimensional semiconductor IC. The sensor array is located relatively close to the device layer of a circuit (e.g., a microprocessor) to be protected from the adverse effects of the ionizing radiation particles. As such, the location where the radiation particles intersect the device layer can be calculated with coarse precision (e.g., to within 10 s of microns).

Abstract: An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device.

Abstract: An array of radiation sensors or detectors is integrated within a three-dimensional semiconductor IC. The sensor array is located relatively close to the device layer of a circuit (e.g., a microprocessor) to be protected from the adverse effects of the ionizing radiation particles. As such, the location where the radiation particles intersect the device layer can be calculated with coarse precision (e.g., to within 10 s of microns).

Abstract: The different advantageous embodiments provide an integrated circuit comprising a number of latches and a number of filters. Each latch in the number of latches has a plurality of inputs and a plurality of storage nodes. The plurality of storage nodes includes a number of pairs of circuit nodes that form a number of upsettable circuit node pairs. Each input of the plurality of inputs is connected to a corresponding storage node in the plurality of storage nodes. Each filter in the number of filters has an input and a plurality of outputs. Each of the plurality of outputs is connected to a corresponding input of the plurality of inputs of a latch in the number of latches. Each filter in the number of filters is located between two circuit nodes forming an upsettable circuit node pair of the latch in the number of latches to increase critical node spacing.

Abstract: The different advantageous embodiments provide an integrated circuit comprising a number of latches and a number of filters. Each latch in the number of latches has a plurality of inputs and a plurality of storage nodes. The plurality of storage nodes includes a number of pairs of circuit nodes that form a number of upsettable circuit node pairs. Each input of the plurality of inputs is connected to a corresponding storage node in the plurality of storage nodes. Each filter in the number of filters has an input and a plurality of outputs. Each of the plurality of outputs is connected to a corresponding input of the plurality of inputs of a latch in the number of latches. Each filter in the number of filters is located between two circuit nodes forming an upsettable circuit node pair of the latch in the number of latches to increase critical node spacing.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device.

Abstract: A digital logic storage structure includes cross coupled first and second complementary metal oxide semiconductor (CMOS) inverters formed on a semiconductor substrate, the CMOS inverters including a first storage node and a second storage node that is the logical complement of the first storage node; both of the first and second storage nodes each selectively coupled to a deep trench capacitor through a switching transistor, with the switching transistors controlled by a common capacitance switch line coupled to gate conductors thereof; wherein, in a first mode of operation, the switching transistors are rendered nonconductive so as to isolate the deep trench capacitors from the inverter storage nodes and, in a second mode of operation, the switching transistors are rendered conductive so as to couple the deep trench capacitors to their respective storage nodes, thereby providing increased resistance of the storage nodes to single event upsets (SEUs).

Abstract: A digital logic storage structure includes cross coupled first and second complementary metal oxide semiconductor (CMOS) inverters formed on a semiconductor substrate, the CMOS inverters including a first storage node and a second storage node that is the logical complement of the first storage node; both of the first and second storage nodes each selectively coupled to a deep trench capacitor through a switching transistor, with the switching transistors controlled by a common capacitance switch line coupled to gate conductors thereof; wherein, in a first mode of operation, the switching transistors are rendered nonconductive so as to isolate the deep trench capacitors from the inverter storage nodes and, in a second mode of operation, the switching transistors are rendered conductive so as to couple the deep trench capacitors to their respective storage nodes, thereby providing increased resistance of the storage nodes to single event upsets (SEUs).