Patents by Inventor Ethan K. Lightle

Ethan K. Lightle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coated metal oxide particles for CMP
    Patent number: 7044836
    Abstract: The invention provides a method of polishing a substrate, which method comprises the steps of (i) providing a polishing composition, (ii) providing a substrate comprising at least one metal layer, and (iii) abrading at least a portion of the metal layer with the polishing composition to polish the substrate. The polishing composition comprises an abrasive and a liquid carrier, wherein the abrasive comprises metal oxide particles having a surface with a silane compound adhered to a portion thereof and a polymer adhered to the silane compound and wherein the polymer is selected from the group consisting of water-soluble polymers and water-emulsifiable polymers. The invention also provides a polishing composition as described above, wherein the total amount of abrasive particles present in the polishing composition is no greater than about 20% by weight of the polishing composition, and the metal oxide particles do not comprise zirconia.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: May 16, 2006
    Assignee: Cabot Microelectronics Corporation
    Inventors: Fred F. Sun, Bin Lu, Ethan K. Lightle, Shumin Wang
  • Coated metal oxide particles for CMP
    Publication number: 20040209555
    Abstract: The invention provides a method of polishing a substrate, which method comprises the steps of (i) providing a polishing composition, (ii) providing a substrate comprising at least one metal layer, and (iii) abrading at least a portion of the metal layer with the polishing composition to polish the substrate. The polishing composition comprises an abrasive and a liquid carrier, wherein the abrasive comprises metal oxide particles having a surface with a silane compound adhered to a portion thereof and a polymer adhered to the silane compound and wherein the polymer is selected from the group consisting of water-soluble polymers and water-emulsifiable polymers. The invention also provides a polishing composition as described above, wherein the total amount of abrasive particles present in the polishing composition is no greater than about 20% by weight of the polishing composition, and the metal oxide particles do not comprise zirconia.
    Type: Application
    Filed: April 21, 2003
    Publication date: October 21, 2004
    Applicant: Cabot Microelectronics Corporation
    Inventors: Fred F. Sun, Bin Lu, Ethan K. Lightle, Shumin Wang