Patents by Inventor Ethan S. Heinrich
Ethan S. Heinrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11032947Abstract: An apparatus includes a coldplate configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers having at least one first material and (ii) a third layer embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones of the coldplate have different local CTEs. The third layer may include openings extending through the second material(s), and projections of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.Type: GrantFiled: February 17, 2020Date of Patent: June 8, 2021Assignee: Raytheon CompanyInventors: Craig H. McCordic, Joseph R. Ellsworth, Todd E. Southard, Ethan S. Heinrich, Dimitry Zarkh
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Patent number: 10693266Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.Type: GrantFiled: October 17, 2018Date of Patent: June 23, 2020Assignee: Raytheon CompanyInventors: Chad Patterson, Duke Quach, Ethan S. Heinrich, Michael M. Fitzgibbon
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Publication number: 20190123498Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.Type: ApplicationFiled: October 17, 2018Publication date: April 25, 2019Inventors: Chad Patterson, Duke Quach, Ethan S. Heinrich, Michael M. Fitzgibbon
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Patent number: 9974159Abstract: An radio-frequency (RF) interposer enables low-cost, high-performance RF interconnection of two or more large-area printed wiring boards (PWBs). The RF interposer may be provided as a multi-port coaxial structure embedded in a metal (or metalized) carrier. The RF interposer may include one or more conductive shims having spring fingers to provide contact across air-gaps between a PWB RF ground plane and a ground plane of the RF interposer. Retractable pins may be used as the coaxial transmission line center conductors. The RF interposer may be provided as an N×M grid of unit cells each having one or more RF ports and a cavities to provide clearance for a PWB component.Type: GrantFiled: November 18, 2015Date of Patent: May 15, 2018Assignee: Raytheon CompanyInventors: Angelo M. Puzella, John B. Francis, Dennis W. Mercier, John Sangiolo, Mark Ackerman, Ethan S. Heinrich
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Publication number: 20170170617Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.Type: ApplicationFiled: February 28, 2017Publication date: June 15, 2017Inventors: Chad Patterson, Duke Quach, Ethan S. Heinrich, Michael M. Fitzgibbon
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Publication number: 20170142824Abstract: An radio-frequency (RF) interposer enables low-cost, high-performance RF interconnection of two or more large-area printed wiring boards (PWBs). The RF interposer may be provided as a multi-port coaxial structure embedded in a metal (or metalized) carrier. The RF interposer may include one or more conductive shims having spring fingers to provide contact across air-gaps between a PWB RF ground plane and a ground plane of the RF interposer. Retractable pins may be used as the coaxial transmission line center conductors. The RF interposer may be provided as an N×M grid of unit cells each having one or more RF ports and a cavities to provide clearance for a PWB component.Type: ApplicationFiled: November 18, 2015Publication date: May 18, 2017Inventors: Angelo M. Puzella, John B. Francis, Dennis W. Mercier, John Sangiolo, Mark Ackerman, Ethan S. Heinrich
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Publication number: 20170093092Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.Type: ApplicationFiled: September 30, 2015Publication date: March 30, 2017Inventors: Chad Patterson, Duke Quach, Ethan S. Heinrich, Michael M. Fitzgibbon
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Patent number: 9590359Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.Type: GrantFiled: September 30, 2015Date of Patent: March 7, 2017Assignee: Raytheon CompanyInventors: Chad Patterson, Duke Quach, Ethan S. Heinrich, Michael M. Fitzgibbon
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Patent number: 9520368Abstract: An integrated circuit system having: (A) a semiconductor chip with a signal strip conductor disposed on an upper surface of the chip; an active semiconductor device disposed of the upper surface of the chip electrically connected to the signal strip conductor; and a first ground plane conductor disposed on a bottom surface of the chip disposed under the signal strip conductor; and (B) a support structure having: a second ground plane disposed over, and separated from, the signal strip conductor by a dielectric region between the second ground plane and the signal strip conductor on the chip; a signal contact disposed on the bottom surface of the support structure displaced, electrically insulated, from the second ground plane conductor, and electrically connected to a portion of the signal strip conductor. The signal strip conductor, the first ground plane conductor, and the second ground plane conductor provide a stripline microwave transmission line.Type: GrantFiled: December 28, 2015Date of Patent: December 13, 2016Assignee: Raytheon CompanyInventors: Samuel D. Tonomura, Anthony M. Petrucelli, Cynthia Y. Hang, Chad Patterson, Ethan S. Heinrich, Michael M. Fitzgibbon, John G. Heston
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Publication number: 20150380343Abstract: A flip-chip mounted semiconductor structure having a flip chip mounting pad and a circuit structure flip-chip mounted to the flip chip mounting pad. The circuit structure includes: a semiconductor die; and a stiffener structure attached to the die, the stiffener structure having a conduit passing through the stiffener structure between a front side of the stiffener structure and a hack side of the stiffener structure, the stiffener and attached die having a degree of rigidity greater than the die alone.Type: ApplicationFiled: June 27, 2014Publication date: December 31, 2015Applicant: RAYTHEON COMPANYInventors: Christopher R. Koontz, Jason G. Milne, Tse E. Wong, Ethan S. Heinrich
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Patent number: 8920091Abstract: A fastener assembly including an elongate fastener adapted to extend through a chamber having a longitudinal axis, a first end and a second end; a first seal disposed at least partially at the first end of the fastener to prevent leakage of fluid from the chamber; and a second seal disposed at least partially at the second end of the fastener to prevent leakage of fluid from the chamber. In a specific embodiment, the first and second seals are conical seals and a third seal is provided by a gasket. The invention also provides a method for securing a fluid filled chamber to a surface by using embodiments of the fastener assembly.Type: GrantFiled: April 29, 2008Date of Patent: December 30, 2014Assignee: Raytheon CompanyInventors: Ethan S. Heinrich, Alberto F. Viscarra, Jennifer G. Wensel, Stephen E. Sox
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Patent number: 8453314Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.Type: GrantFiled: February 7, 2012Date of Patent: June 4, 2013Assignee: Raytheon CompanyInventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri
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Publication number: 20120137505Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.Type: ApplicationFiled: February 7, 2012Publication date: June 7, 2012Inventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri
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Patent number: 8127432Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.Type: GrantFiled: November 17, 2009Date of Patent: March 6, 2012Assignee: Raytheon CompanyInventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri
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Publication number: 20110113618Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.Type: ApplicationFiled: November 17, 2009Publication date: May 19, 2011Inventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri
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Publication number: 20090269162Abstract: A fastener assembly including an elongate fastener adapted to extend through a chamber having a longitudinal axis, a first end and a second end; a first seal disposed at least partially at the first end of the fastener to prevent leakage of fluid from the chamber; and a second seal disposed at least partially at the second end of the fastener to prevent leakage of fluid from the chamber. In a specific embodiment, the first and second seals are conical seals and a third seal is provided by a gasket.Type: ApplicationFiled: April 29, 2008Publication date: October 29, 2009Inventors: Ethan S. Heinrich, Alberto F. Viscarra, Jennifer G. Wensel, Stephen E. Sox