Patents by Inventor Ethan Schmitz

Ethan Schmitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING
    Publication number: 20250022769
    Abstract: Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.
    Type: Application
    Filed: May 7, 2024
    Publication date: January 16, 2025
    Inventors: Luke Gregory, Jimil Shah, Ethan Schmitz, Richard Eiland, Ioannis Manousakis
  • Boiler enhancement coatings with active boiling management
    Patent number: 12178005
    Abstract: Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: December 24, 2024
    Assignee: MTS IP Holdings Ltd
    Inventors: Luke Gregory, Jimil Shah, Ethan Schmitz, Richard Eiland
  • Boiler Enhancement Coatings with Active Boiling Management
    Publication number: 20240407129
    Abstract: Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 5, 2024
    Applicant: MTS IP Holdings Ltd
    Inventors: Luke Gregory, Jimil Shah, Ethan Schmitz, Richard Eiland
  • Direct to chip application of boiling enhancement coating
    Patent number: 12051637
    Abstract: Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.
    Type: Grant
    Filed: September 1, 2023
    Date of Patent: July 30, 2024
    Assignee: MTS IP Holdings Ltd
    Inventors: Luke Gregory, Jimil Shah, Ethan Schmitz, Richard Eiland, Ioannis Manousakis