Abstract: An automated analyzer is described. The analyzer includes a housing, a consumable insert, a consumable support device, a reader and a control system. The housing has a sample port. The consumable insert has a consumable insert type and an identification component and receives a consumable. The consumable support device is disposed within the sample port, supports the consumable insert, and is moveable to a testing position within the internal cavity. The consumable support device has an identifier component configured to identify the consumable insert type based in part on the identification component and configured to output a first data signal indicative of the consumable insert type. The reader outputs a second data signal indicative of a reading from the consumable. The control system receives the first and second data signals, and interprets the second data signal based on the first data signal.

Abstract: An automated analyzer is described. The analyzer includes a housing, a consumable insert, a consumable support device, a reader and a control system. The housing has a sample port. The consumable insert has a consumable insert type and an identification component and receives a consumable. The consumable support device is disposed within the sample port, supports the consumable insert, and is moveable to a testing position within the internal cavity. The consumable support device has an identifier component configured to identify the consumable insert type based in part on the identification component and configured to output a first data signal indicative of the consumable insert type. The reader outputs a second data signal indicative of a reading from the consumable. The control system receives the first and second data signals, and interprets the second data signal based on the first data signal.

Abstract: A method and apparatus for forming a layer of underfill encapsulant on an integrated circuit located on a wafer are described. As a flip chip, the integrated circuit has electrically conductive pads, most of which have a solder ball attached thereto. Most of the solder balls have been flattened in order to provide an enlarged solder wetting area. A layer of underfill encapsulant is injected onto the integrated circuit under pressure to form a layer of underfill encapsulant that is then pre-cured. The integrated circuit is mounted to a substrate and the substrate and the integrated circuit are electrically coupled by a solder reflow operation which also finally cures the underfill encapsulant.