Patents by Inventor Ethan Zhou

Ethan Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier with different surface finishes
    Patent number: 10806027
    Abstract: A component carrier being less prone to deterioration by oxidation and a method for manufacturing the same are disclosed. The component carrier includes a laminated stack with a first surface finish covering a first part of an exposed surface of the laminated stack and a second surface finish covering a second part of an exposed surface of the laminated stack. The first surface finish and the second surface finish are arranged in direct contact with one another so as to at least partially overlap.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: October 13, 2020
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Mikael Tuominen, Li Ping, Ethan Zhou, Karl Wang, Giordano-Maria Di Gregorio
  • Semi-finished product for the production of a printed circuit board and method for producing the same
    Patent number: 9820381
    Abstract: In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: November 14, 2017
    Assignee: AT&S Austria Technologie Systemtechnik Aktiengesellschaft
    Inventors: Vic Wang, Ethan Zhou, Laura Bai, Mikael Tuominen, Al Chen
  • Component Carrier With Different Surface Finishes
    Publication number: 20170196081
    Abstract: A component carrier being less prone to deterioration by oxidation and a method for manufacturing the same are disclosed. The component carrier includes a laminated stack with a first surface finish covering a first part of an exposed surface of the laminated stack and a second surface finish covering a second part of an exposed surface of the laminated stack. The first surface finish and the second surface finish are arranged in direct contact with one another so as to at least partially overlap.
    Type: Application
    Filed: January 3, 2017
    Publication date: July 6, 2017
    Inventors: Mikael Tuominen, Li Ping, Ethan Zhou, Karl Wang, Giordano-Maria Di Gregorio
  • Semi-Finished Product for the Production of a Printed Circuit Board and Method for Producing the Same
    Publication number: 20150334833
    Abstract: In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage.
    Type: Application
    Filed: December 20, 2013
    Publication date: November 19, 2015
    Applicant: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
    Inventors: Vic Wang, Ethan Zhou, Laura Bai, Mikael Tuominen, Al Chen