Patents by Inventor Etienne Navarro

Etienne Navarro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11171158
    Abstract: A semiconductor on insulator type substrate, comprising at least: a support layer; a semiconductor surface layer; a buried dielectric layer located between the support layer and the semiconductor surface layer; a trap rich layer located between the buried dielectric layer and the support layer, and comprising at least one polycrystalline semiconductor material and/or a phase change material; in which the trap rich layer comprises at least one first region and at least one second region adjacent to each other in the plane of the trap rich layer, the material of the at least one first region being in an at least partially recrystallized state and having an electrical resistivity less than that of the material in the at least one second region.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: November 9, 2021
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Yann Lamy, Lamine Benaissa, Etienne Navarro
  • Publication number: 20200161336
    Abstract: A semiconductor on insulator type substrate, comprising at least: a support layer; a semiconductor surface layer; a buried dielectric layer located between the support layer and the semiconductor surface layer; a trap rich layer located between the buried dielectric layer and the support layer, and comprising at least one polycrystalline semiconductor material and/or a phase change material; in which the trap rich layer comprises at least one first region and at least one second region adjacent to each other in the plane of the trap rich layer, the material of the at least one first region being in an at least partially recrystallized state and having an electrical resistivity less than that of the material in the at least one second region.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 21, 2020
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Yann LAMY, Lamine BENAISSA, Etienne NAVARRO
  • Patent number: 10586810
    Abstract: A semiconductor on insulator type substrate, comprising at least: a support layer; a semiconductor surface layer; a buried dielectric layer located between the support layer and the semiconductor surface layer; a trap rich layer located between the buried dielectric layer and the support layer, and comprising at least one polycrystalline semiconductor material and/or a phase change material; in which the trap rich layer comprises at least one first region and at least one second region adjacent to each other in the plane of the trap rich layer, the material of the at least one first region being in an at least partially recrystallized state and having an electrical resistivity less than that of the material in the at least one second region.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: March 10, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Yann Lamy, Lamine Benaissa, Etienne Navarro
  • Patent number: 9240343
    Abstract: This process comprises steps of: a) providing a first substrate comprising the active layer made of a first material of Young's modulus E1 and of thickness h1; b) providing a second substrate made of a second material of Young's modulus E2 and of thickness h2; c) bending the first substrate and the second substrate such that they each have a curved shape of a radius of curvature R; d) joining the second substrate to the active layer such that the second substrate closely follows the shape of the first substrate; and e) re-establishing the initial at-rest shape of the second substrate, the process being noteworthy in that the second material of the second substrate is a flexible material respecting the relationship E2/E1<10?2, in that the thickness of the second substrate respects the relationship h2/h1?104, and in that the radius of curvature respects the relationship R = h 2 2 ? ? ? .
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: January 19, 2016
    Assignee: SOITEC
    Inventors: Yves-Matthieu Le Vaillant, Etienne Navarro
  • Publication number: 20150249033
    Abstract: This process comprises steps of: a) providing a first substrate comprising the active layer made of a first material of Young's modulus E1 and of thickness h1; b) providing a second substrate made of a second material of Young's modulus E2 and of thickness h2; c) bending the first substrate and the second substrate such that they each have a curved shape of a radius of curvature R; d) joining the second substrate to the active layer such that the second substrate closely follows the shape of the first substrate; and e) re-establishing the initial at-rest shape of the second substrate, the process being noteworthy in that the second material of the second substrate is a flexible material respecting the relationship E2/E1<10?2, in that the thickness of the second substrate respects the relationship h2/h1?104, and in that the radius of curvature respects the relationship R = h 2 2 ? ? ? .
    Type: Application
    Filed: October 11, 2013
    Publication date: September 3, 2015
    Inventors: Yves-Matthieu Le Vaillant, Etienne Navarro