Abstract: A release device for a vaporizable and/or sublimateable pesticide is provided. The release device is suitable for use against subterranean pests (e.g. fire ants). The release device may be driven into and/or placed in a cavity within the soil or other substrate where the pests reside. The release device comprises a vapor injector which releases the pesticidal composition through apertures into the pest habitat, where it is distributed in vapor form.

Abstract: A cleaning apparatus engageable with a vacuum source is provided. The vacuum source can be used to draw fluid through an interior space of a housing of the cleaning apparatus through an inlet tube so that debris entrained in the fluid collects in a debris collection zone upstream of a downstream opening in the inlet tube. Methods of using the cleaning apparatus are provided.

Abstract: Devices and methods for the control of pests, including plant pests, using the vapors of a plant health, pesticidal and/or pest control composition are disclosed. Compositions, devices and methods for the selective control of plant or other pests while not harming one or more beneficial insects are also disclosed. In some embodiments, the pests are include bugs, fleas, lice, ticks, plant pathogenic insects, acari, or the like. In some embodiments, the pests are varroa mites and the beneficial insects are honey bees.

Abstract: Devices and methods for the control of pests using the vapors of a pesticidal and/or pest control composition are disclosed. Compositions, devices and methods for the selective control of pests while not harming one or more beneficial insects are also disclosed. In some embodiments, the pests are bed bugs, fleas, lice, ticks, or the like. In some embodiments, the pests are varroa mites and the beneficial insects are honey bees.

Abstract: Devices and methods for the control of pests using the vapors of a pesticidal composition. Compostions, devices and methods for the selective control of pests while not harming one or more beneficial insects are also disclosed. In some embodiments, the pests are bed bugs, fleas, lice, ticks, or the like. In some embodiments, the pests are varroa mites and the beneficial insects are honey bees.

Abstract: To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

Abstract: An object of the invention is to provide a method of manufacturing a light-emitting element, in which residue from a fixing resin layer is less likely to be left on a semiconductor layer and a supporting base in the case of manufacturing the light-emitting element by a laser lift-off technique. Furthermore, another object of the invention is to provide a highly reliable light-emitting element that is manufactured by the method of the present invention. The above-described objects are accomplished by applying a thermally decomposable resin composition as a fixing resin layer that fixes the semiconductor layer to a supporting base, and by thermally decomposing the fixing resin layer at the time of peeling off the semiconductor layer from the supporting base.

Abstract: Disclosed is a method for manufacturing an electronic device, the method including: placing an electronic component on a substrate 11; forming standing portions 13 on the surface of the substrate 11 on which the electronic component 10 is placed, the standing portions 13 comprising a thermally decomposable resin; applying an encapsulating material 14 so as to encapsulate the electronic component 10 and cover around the standing portions 13 while exposing a portion of each of the standing portions 13 from the surface of the encapsulating material 14; heating the standing portions 13 to decompose and remove the standing portions 13, thereby forming holes 141 through the encapsulating material 14; and placing a conductive material 15 in the holes 141.

Abstract: To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

Abstract: A polymer includes a first type of repeat unit represented by Formula I: where X is selected from —CH2—, —CH2—CH2—, or —O—; m is an integer from 0 to about 5; and where for the first type of repeat unit one of R1, R2, R3, and R4 is one of a maleimide containing group and for the second type of repeat unit one of R1, R2, R3, and R4 is a hindered aromatic group, a C8 or greater alkyl group, a C4 or greater halohydrocarbyl or perhalocarbyl group, a C7 or greater aralkyl group, or a heteroatom hydrocarbyl or halohydrocarbyl group.

Abstract: To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same. A temporary bonding adhesive for a semiconductor device is provided, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition such that the difference between the 95% weight loss temperature and the 5% weight loss temperature is 1 degree Celsius?(95% weight loss temperature)?(5% weight loss temperature)?300 degrees Celsius.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: A polymer includes a first type of repeat unit represented by Formula I: where X is selected from —CH2—, —CH2—CH2—, or —O—; m is an integer from 0 to about 5; and where for the first type of repeat unit one of R1, R2, R3, and R4 is one of a maleimide containing group and for the second type of repeat unit one of R1, R2, R3, and R4 is a hindered aromatic group, a C8 or greater alkyl group, a C4 or greater halohydrocarbyl or perhalocarbyl group, a C7 or greater aralkyl group, or a heteroatom hydrocarbyl or halohydrocarbyl group.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.

Abstract: A photosensitive resin composition comprising an oxygen sensitizer and a polyamic acid or a polyimide which has substituents having a cis-diene structure at the side chains; a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating the substrate with the composition and forming fine patterns by exposure of irradiation; and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device which comprise coating the substrate with the composition and forming fine patterns by crosslinking the cis-diene group by polycondensation with oxidation with the singlet oxygen generated by exposure of irradiation to the oxygen sensitizer in the presence of oxygen.

Abstract: A photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or a polyimide. A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with the photosensitive resin composition and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprise coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition can form a resin layer having excellent heat resistance.