Patents by Inventor Etsuhiro MAEDA

Etsuhiro MAEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220313602
    Abstract: An object is to provide a tablet manufacturing apparatus capable of supplying an IC chip to a desired position of pharmaceutical powder with a high accuracy and suppressing a positional displacement. The IC chip is supported by a positioning guide with a chip main body in a downward manner, and is held in a state of being positioned above pharmaceutical powder filled in a die hole before compression. The IC chip is supplied by a pusher.
    Type: Application
    Filed: June 15, 2022
    Publication date: October 6, 2022
    Applicants: Otsuka Pharmaceutical Co., Ltd., Omori Machinery Co., LTD.
    Inventors: Etsuhiro MAEDA, Yasutoshi KOHATA
  • Publication number: 20170181969
    Abstract: An object is to provide a tablet manufacturing apparatus capable of supplying an IC chip to a desired position of pharmaceutical powder with a high accuracy and suppressing a positional displacement. The IC chip is supported by a positioning guide with a chip main body in a downward manner, and is held in a state of being positioned above pharmaceutical powder filled in a die hole before compression. The IC chip is supplied by a pusher.
    Type: Application
    Filed: March 7, 2017
    Publication date: June 29, 2017
    Applicants: OTSUKA PHARMACEUTICAL CO., LTD., OMORI MACHINERY CO., LTD.
    Inventors: Etsuhiro MAEDA, Yasutoshi KOHATA
  • Patent number: 9610225
    Abstract: An object is to provide a tablet manufacturing apparatus capable of supplying an IC chip to a desired position of pharmaceutical powder with a high accuracy and suppressing a positional displacement. The IC chip is supported by a positioning guide with a chip main body in a downward manner, and is held in a state of being positioned above pharmaceutical powder filled in a die hole before compression. The IC chip is supplied by a pusher.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: April 4, 2017
    Assignees: Otsuka Pharmaceutical Co., Ltd., Omori Machinery Co., Ltd.
    Inventors: Etsuhiro Maeda, Yasutoshi Kohata
  • Publication number: 20150328150
    Abstract: An object is to provide a tablet manufacturing apparatus capable of supplying an IC chip to a desired position of pharmaceutical powder with a high accuracy and suppressing a positional displacement. The IC chip is supported by a positioning guide with a chip main body in a downward manner, and is held in a state of being positioned above pharmaceutical powder filled in a die hole before compression. The IC chip is supplied by a pusher.
    Type: Application
    Filed: December 19, 2013
    Publication date: November 19, 2015
    Inventors: Etsuhiro MAEDA, Yasutoshi KOHATA