Abstract: A sensing device includes a lead frame, a first insulating film, a semiconductor integrated circuit chip provided over the lead frame via the first insulating film, and a first bonding wire via which an external derivation lead and the semiconductor integrated circuit chip are electrically coupled to each other. The sensing device includes a sensor chip disposed over the semiconductor integrated circuit chip such that a first surface of the sensor chip faces the semiconductor integrated circuit chip. The sensing device includes a sensor provided on a second surface of the sensor chip. The sensing device includes a molding resin with which the lead frame, the semiconductor integrated circuit chip, the sensor chip, and the first bonding wire are sealed. The sensor chip is electrically coupled to the semiconductor integrated circuit chip, and the molding resin has an opening in which the sensor is exposed.

Abstract: A sensing device includes a lead frame, a first insulating film, a semiconductor integrated circuit chip provided over the lead frame via the first insulating film, and a first bonding wire via which an external derivation lead and the semiconductor integrated circuit chip are electrically coupled to each other. The sensing device includes a sensor chip disposed over the semiconductor integrated circuit chip such that a first surface of the sensor chip faces the semiconductor integrated circuit chip. The sensing device includes a sensor provided on a second surface of the sensor chip. The sensing device includes a molding resin with which the lead frame, the semiconductor integrated circuit chip, the sensor chip, and the first bonding wire are sealed. The sensor chip is electrically coupled to the semiconductor integrated circuit chip, and the molding resin has an opening in which the sensor is exposed.

Abstract: A method for manufacturing a semiconductor device includes providing a wafer that includes a device region and a peripheral region of the device region, the device region including multiple chip regions. The method includes removing a portion of the peripheral region such that the removed portion has an annular shape. The method includes forming a protective layer on a first surface of the wafer. The method includes grinding a second surface of the wafer in which the protective layer is formed on the first surface.

Abstract: A control device for a laser scanning display apparatus includes a laser device, a current source that generates an electric current supplied to the laser device, and a controller that controls the current source to set a current value of the electric current supplied to the laser device. During a period for scanning a non-display area where no image is displayed, the controller sets the current value at a first drive current value that is less than a threshold current value at which the laser device starts oscillating; and during a period for scanning a portion with a luminance level of zero in a display area where an image is displayed, the controller sets the current value at a second drive current value that is greater than or equal to the first drive current value and less than the threshold current value.

Abstract: A control device, which controls a laser scanning display device, includes a laser device, a first current source that generates a first driving current supplied to the laser device, a second current source that generates a second driving current supplied to the laser device, and a controller. The controller controls the first current source to generate the first driving current having a first set current value that is 1/n times a threshold current value at a time when oscillation of the laser device starts, when scanning a non-display area in which no image is displayed, where n is a number greater than 1. The controller controls the second current source to generate the second driving current having a second set current value that is zero or greater and less than 1?1/n times the threshold current value, when scanning the non-display area.

Abstract: A control device for a laser scanning display apparatus includes a laser device, a current source that generates an electric current supplied to the laser device, and a controller that controls the current source to set a current value of the electric current supplied to the laser device. During a period for scanning a non-display area where no image is displayed, the controller sets the current value at a first drive current value that is less than a threshold current value at which the laser device starts oscillating; and during a period for scanning a portion with a luminance level of zero in a display area where an image is displayed, the controller sets the current value at a second drive current value that is greater than or equal to the first drive current value and less than the threshold current value.

Abstract: A control device, which controls a laser scanning display device, includes a laser device, a first current source that generates a first driving current supplied to the laser device, a second current source that generates a second driving current supplied to the laser device, and a controller. The controller controls the first current source to generate the first driving current having a first set current value that is 1/n times a threshold current value at a time when oscillation of the laser device starts, when scanning a non-display area in which no image is displayed, where n is a number greater than 1. The controller controls the second current source to generate the second driving current having a second set current value that is zero or greater and less than 1?1/n times the threshold current value, when scanning the non-display area.

Abstract: A control apparatus is used in a display apparatus. The control apparatus includes a laser element; a temperature sensor configured to detect a temperature of the laser element; a laser driver configured to drive the laser element; and a laser control unit configured to control a driving current to be supplied to the laser element by the laser driver, such that an optical output value of the laser element converges to a target optical output value. The laser control unit determines an initial driving current value that causes an initial optical output value to be output from the laser element, based on temperature characteristic data of the initial driving current value, and a detection temperature of the laser element detected by the temperature sensor, and controls the driving current to start from the determined initial driving current value.

Abstract: A waveguide type optical isolator comprises a substrate, a waveguiding layer provided with waveguides, a magnetic garnet, magnetic field applying means, and a package substrate, wherein a first magnet and a second magnet is provided as the magnetic field applying means, and the first magnet and the second magnet are housed and fixed within a magnet holder.

Abstract: A waveguide type optical isolator comprises a substrate, a waveguiding layer provided with waveguides, a magnetic garnet, magnetic field applying means, and a package substrate, wherein a first magnet and a second magnet is provided as the magnetic field applying means, and the first magnet and the second magnet are housed and fixed within a magnet holder.