Abstract: A contact structure of a lead in which a contact structure having a lead and a bump made of suitable metals, respectively, can be formed easily and the bump and the lead can be soundly connected together in terms of electricity and strength. The contact structure of the lead comprises a lead 12 formed by etching a conductive foil 11, and a bump 5 formed by electric casting by means of plating. The bump 5 and the lead 12 are formed of different metals, respectively, and the bump 5 is connected to a surface of the lead 12 through a conductive connecting material 10. The lead 12 is intimately contacted at a surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8. A basal portion of the bump 5 is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 is fusion-adhered to an inner wall surface of the through-hole 17.

Abstract: A plurality of protective resistors can be easily inserted between circuit forming elements, and opposite ends of each protective resistor can be properly press-contacted to each circuit forming element. The protective resistor can be easily replaced when broken. A resistor array board comprises a porous plate having a plurality of through-holes arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors removably loosely inserted into the through-holes, respectively. Each of the protective resistors are resiliently retained by an electrically conductive spring element, and opposite ends of each of the protective resistors are press-contacted with the circuit forming elements which are arranged in opposing relation on surfaces of the porous plates.

Abstract: To provide a contact structure of a lead in which a contract structure having a lead and a bump made of suitable metals, respectively, is formed easily and in which the bump and the lead are soundly connected together in terms of electricity and strength.

Abstract: A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.

Abstract: To easily achieve an object for inserting, as one group, a plurality of protective resistors between circuit forming elements and properly press contacting opposite ends of each protective resistor to each circuit forming element. Also to make it easy to replace the protective resistor when it is broken. A resistor array board 1 comprises a porous plate 3 having a plurality of through-holes 2 arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors R removably loosely inserted into the through-holes 12 respectively, each of protective resistors R being resiliently retained by each electrically conductive spring element R, and opposite ends of each of the protective resistors R being press contacted with each of the circuit forming elements 10, 10′ which are arranged in opposing relation on each surface of said porous plate 3.

Abstract: A contact device of the present invention is able to contact with a spherical test terminal. The contact device has a spring and a contact part. Also, the contact part has one end on which two or more protruded portions are formed and the other end on which a top end of the sprig is attached. The protruded portions are able to contact with a spherical surface of the spherical test terminal except for the top thereof with a high degree of precision and a high degree of the contact reliability.

Abstract: A structure of a conductive bump in a wiring board having a wiring pattern on a surface of an insulating base, characterized in that a local portion of the insulating base is raised from the surface of the insulating base to form a projection and a surface of the projection is covered with a part of a lead forming the wiring pattern to form a conductive bump.

Abstract: An interlayer connection structure in a circuit board characterized in that a local part of a conductive circuit layer disposed at one surface side of an insulative sheet is bent inwardly of the insulative sheet so that an apex of a projectingly bent portion is formed, and the apex of the projectingly bent portion is abutted with another conductive circuit layer disposed at the other surface side of the insulative sheet so that an interlayer connection is established therebetween.

Abstract: An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring sheet covering the upper surface of the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface of the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces of the flexible wiring sheet covering side surfaces of the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface of the upper flexible wiring sheet.

Abstract: A contact converting structure of a semiconductor chip comprises a semiconductor chip with a group of electrodes arranged on a surface of one side thereof. A liquid crystal polymer film is bonded to the surface in such a manner as to cover the electrodes group, and a group of external contacts is arranged on the other surface of the semiconductor chip. The external contacts group is connected to the electrodes group through the liquid crystal polymer film. A process for manufacturing a semiconductor chip having such a contact converting structure is also disclosed.

Abstract: A circuit board includes a wiring board which includes an insulative board having a wiring pattern on one surface thereof, a connection hole being formed in the insulative board such that the connection hole reaches the wiring pattern, a conductive bump, which is formed by growing a plating on the wiring pattern, being embedded in the connection hole, and the conductive bump serves as a connection to a wiring pattern which is intimately attached to the other surface of the insulative board.

Abstract: A pattern position detecting apparatus has an ITV camera for receiving the image of a pattern of the IC chip and a memory for storing therein the image signal from the ITV camera as a pattern data. When the pattern data is read out from the memory, a pattern section is shifted every second picture-element array in the horizontal and vertical directions and the picture elements are picked up every second picture element from the pattern section. The pattern data corresponding to the pattern sections read out from the memory are compared with reference pattern data, whereby determination is made of the degree of coincidence between both of the patterns. After determination has been made of the degrees of coincidence with respect to the whole pattern, detection is made of the position of the pattern section having the highest degree of coincidence among said degrees of coincidence in accordance with the address of the memory.

Abstract: A method and apparatus for detecting defects in a pattern are disclosed. The defect detecting method is comprised of a step of dark-field illuminating a patterned object with a directionality and a step for detecting only the defect component by erasing the pattern component in a pattern image formed by the dark-field illumination. The apparatus comprises an illuminating device for dark-field illuminating a patterned object with parallel rays, an image pick-up device for picking up a pattern image, which is disposed just above the pattern, and a data processing circuit for processing the picked up image signal to detect a defect.

Abstract: The convergence of a color picture tube is measured by first indicating a prescribed pattern in a reference position on the picture tube. The image of a pattern for each light beam color in the picture tube is picked-up, and then this display position of the pattern is shifted. An image of the pattern in the shifted position is then picked-up for each beam color in the tube which gives a second image pick-up data. The average values of the data obtained from the non-shifted and shifted pattern for each light beam color is used to determine the convergence of the color picture tube.

Abstract: The rear and front surfaces of a printed circuit board are illuminated by parallel light beams from first and second illuminating systems, respectively. The obtained transmitted light and reflected light are received by an image sensor through a lens system to provide video data which is stored in a video memory. Abrasion scars are formed by brushing the surfaces of terminals formed on the front surface of the printed circuit board prior to soldering. The presence or absence of a chip element is discriminated by a microprocessor in accordance with the difference between reflection factors of light emitted by the second illuminating system and reflected from the terminals and light reflected from the chip element.

Abstract: An apparatus for conveying a lead frame mounting semiconductor pellets comprises a guide path for guiding the lead frame, and a feed member. The feed member is moved by a solenoid mechanism from a first position where the feed member is separated from the lead frame to a second position where the feed member engages with the lead frame. The feed member positioned in the second position is moved by a X-Y table from an initial position to a forward position along the guide path, whereby the lead frame is conveyed along the guide path by a predetermined distance.

Abstract: Image data of lead terminals and a chip element provided on a circuit board are stored on a video memory. Part of the video data stored in the video memory is read out and stored in a RAM by a microprocessor to be compared with reference pattern data stored in an external memory. The position of the chip element is checked in this way by having reference to the lead terminals.

Abstract: A method for automatically controlling the position of small objects, comprises the steps of moving the object to cause at least a portion of an optical image of the object to be imaged on a photoelectric array which is placed on an image formation plane; sequentially detecting outputs by scanning photoelectric converting elements constituting the photoelectric array; counting, in a digital fashion, the position data of the object based on the above-mentioned outputs to deliver a correction signal for moving the object to a predetermined position; moving the object to a predetermined position according to the correction signal; and checking the position of the object by detecting outputs of respective photoelectric converting elements after completion of the above-mentioned movement step and calculating the positional data of the object.

Abstract: According to the present method of positioning a semiconductor member by examining it, an optical image of the semiconductor member is focussed on a photoelectric conversion face formed by having a plurality of photoelectric conversion elements arranged thereon in the form of a matrix. By means of the photoelectric conversion elements spotlighted by said optical image, the distributions of the spotlighted elements and the remaining non-spotlighted elements are examined through scanning operation.

Abstract: A system comprising a detector for detecting a shift of a optical pattern formed on a semiconductor pellet at a distance from the datum point set on both sides of the pattern and giving a signal indicative of said shift, and a bonding device for wire-bonding said pellet with the shift compensated which has been shifted correspondingly to the shift of the pellet.