Abstract: To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.

Abstract: To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.

Abstract: To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.

Abstract: An easy-to-use and inexpensive memory device is provided while maintaining product specifications and productivity even when a memory is formed on the same substrate as other functional circuits. The memory device of the invention includes a memory cell formed on an insulating surface. The memory cell includes a semiconductor film having two impurity regions, a gate electrode, and two wirings connected to the respective impurity regions. The two wirings are insulated from each other by applying a voltage between the gate electrode and at least one of the two wirings to alter the state of the semiconductor film.

Abstract: A semiconductor device of which manufacturing steps can be simplified by doping impurities at a time, and a manufacturing method thereof.

Abstract: The present invention provides a method for evaluating an intended element or a parameter. In addition, the invention provides an evaluation method for obtaining a more precise result rapidly. According to the invention, a plurality of evaluation circuits are formed over the same substrate, and while simultaneously operating the plurality of evaluation circuits, an output of one evaluation circuit selected by a selection circuit that is formed over the substrate is arbitrarily evaluated.

Abstract: The reliability of a GOLD structure TFT depends on an impurity concentration in its gate-overlapped region. Thus, it is an object of the present invention to obtain a resistance distribution corresponding to a tapered shape of a gate electrode in a gate-overlapped region. According to the present invention, plural TEGs are manufactured as Lov resistance monitors in which mask alignment is misaligned with several ?m interval to perform a resistance measurement on each of the TEGs. Consequently, a resistance distribution corresponding to a tapered shape can be obtained in a channel forming region, a gate-overlapped region and a source/drain region.

Abstract: The present invention provides a method for manufacturing a semiconductor device having high characteristic and reliability. The etching damage during dry etching after forming an electrode or a wiring over an insulating film is prevented. The damage is suppressed by forming a conductive layer so that charged particles due to plasma during dry etching are not generated in a semiconductor layer. Accordingly, it is an object of the invention to provide a method not for generating the deterioration of the transistor characteristic especially in a thin film transistor having a minute structure.

Abstract: To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.

Abstract: An easy-to-use and inexpensive memory device is provided while maintaining product specifications and productivity even when a memory is formed on the same substrate as other functional circuits. The memory device of the invention includes a memory cell formed on an insulating surface. The memory cell includes a semiconductor film having two impurity regions, a gate electrode, and two wirings connected to the respective impurity regions. The two wirings are insulated from each other by applying a voltage between the gate electrode and at least one of the two wirings to alter the state of the semiconductor film.

Abstract: The reliability of a GOLD structure TFT depends on an impurity concentration in its gate-overlapped region. Thus, it is an object of the present invention to obtain a resistance distribution corresponding to a tapered shape of a gate electrode in a gate-overlapped region. According to the present invention, plural TEGs are manufactured as Lov resistance monitors in which mask alignment is misaligned with several ?m interval to perform a resistance measurement on each of the TEGs. Consequently, a resistance distribution corresponding to a tapered shape can be obtained in a channel forming region, a gate-overlapped region and a source/drain region.

Abstract: The invention performs an AC stress test assuming the CMOS operation and an AC stress test using a ring oscillator (R.O.) between a DC stress test method using single semiconductor elements and an aging test method. The deterioration of a semiconductor apparatus can be estimated highly precisely by separately performing the AC stress test assuming the CMOS operation on OFF-stress and ON-stress.

Abstract: The present invention provides a method for evaluating an intended element or a parameter. In addition, the invention provides an evaluation method for obtaining a more precise result rapidly. According to the invention, a plurality of evaluation circuits are formed over the same substrate, and while simultaneously operating the plurality of evaluation circuits, an output of one evaluation circuit selected by a selection circuit that is formed over the substrate is arbitrarily evaluated.

Abstract: The reliability of a GOLD structure TFT depends on an impurity concentration in its gate-overlapped region. Thus, it is an object of the present invention to obtain a resistance distribution corresponding to a tapered shape of a gate electrode in a gate-overlapped region. According to the present invention, plural TEGs are manufactured as Lov resistance monitors in which mask alignment is misaligned with several ?m interval to perform a resistance measurement on each of the TEGs. Consequently, a resistance distribution corresponding to a tapered shape can be obtained in a channel forming region, a gate-overlapped region and a source/drain region.

Abstract: A semiconductor device of which manufacturing steps can be simplified by doping impurities at a time, and a manufacturing method thereof.

Abstract: The present invention provides a method for evaluating an intended element or a parameter. In addition, the invention provides an evaluation method for obtaining a more precise result rapidly. According to the invention, a plurality of evaluation circuits are formed over the same substrate, and while simultaneously operating the plurality of evaluation circuits, an output of one evaluation circuit selected by a selection circuit that is formed over the substrate is arbitrarily evaluated.

Abstract: A semiconductor device of which manufacturing steps can be simplified by doping impurities at a time, and a manufacturing method thereof.

Abstract: It is an object of the present invention to provide a method for evaluating a semiconductor device including a semiconductor, an insulator, and a conductor. The present invention has a first step of applying a voltage to a conductor to measure a current value, a second step of dividing the current value by an area of a region in which a semiconductor is overlapped with the conductor to calculate a current density Jg, and a third step of calculating a depletion layer edge leakage current and an in-plane leakage current by using coefficients of a formula Jg=2A/r+B (A and B are respectively constants) that has a reciprocal of the radius r and the current density Jg.

Abstract: The present invention provides a method for evaluating an intended element or a parameter. In addition, the invention provides an evaluation method for obtaining a more precise result rapidly. According to the invention, a plurality of evaluation circuits are formed over the same substrate, and while simultaneously operating the plurality of evaluation circuits, an output of one evaluation circuit selected by a selection circuit that is formed over the substrate is arbitrarily evaluated.

Abstract: The present invention provides a method for manufacturing a semiconductor device having high characteristic and reliability. The etching damage during dry etching after forming an electrode or a wiring over an insulating film is prevented. The damage is suppressed by forming a conductive layer so that charged particles due to plasma during dry etching are not generated in a semiconductor layer. Accordingly, it is an object of the invention to provide a method not for generating the deterioration of the transistor characteristic especially in a thin film transistor having a minute structure.