Patents by Inventor Etsuko Suzuki

Etsuko Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250320180
    Abstract: There is provided a compound which, while being a curable resin, can easily exhibit repairability and remoldability when being in the form of a cured product, a curable resin composition obtained using the same; and a cured product thereof. A hydroxyl group-containing compound is used, in which a structural unit A having one or more hydroxyl groups and a structural unit B different from the structural unit A are linked in A-B-A, and the structural unit A and the structural unit B are bonded by a reversible bond having a dissociation temperature of 120° C. or higher. This reversible bond is preferably an addition-type structure formed by an anthracene-type Diels-Alder reaction or a disulfide bond sandwiched between aromatic rings.
    Type: Application
    Filed: May 11, 2023
    Publication date: October 16, 2025
    Applicant: Dic Corporation
    Inventors: Yuu Asano, Etsuko Suzuki, Masato Otsu, Kazuo Arita
  • Publication number: 20250277081
    Abstract: There is provided a compound which, while being a curable resin, can easily exhibit repairability and remoldability when being in the form of a cured product, a curable resin composition obtained using the same, and a cured product thereof. A glycidyl ether group-containing compound is used, in which a structural unit A having one or more glycidyl ether groups and a structural unit B different from the structural unit A are linked in A-B-A, and the structural unit A and the structural unit B are bonded by a reversible bond having a dissociation temperature of 120° C. or higher. This reversible bond is preferably an anthracene-type addition-type structure formed by a Diels-Alder reaction or a disulfide bond sandwiched between aromatic rings.
    Type: Application
    Filed: May 11, 2023
    Publication date: September 4, 2025
    Applicant: DIC Corporation
    Inventors: Etsuko Suzuki, Yuu Asano, Masato Otsu, Kazuo Arita
  • Publication number: 20250026928
    Abstract: An object is to provide a crosslinkable resin composition having mechanical strength and capable of exhibiting flexibility, repairability, and remoldability in a low-temperature region including room temperature and contributing to prolongation of the life of cured product itself and a decrease in waste. Specifically, used is a crosslinkable resin composition which can form a cured product having a phase-separated structure formed of a continuous phase and a discontinuous phase and in which discontinuous phase has higher tensile elastic modulus than continuous phase, and continuous phase containing a reversible bond.
    Type: Application
    Filed: October 20, 2022
    Publication date: January 23, 2025
    Applicant: DIC Corporation
    Inventors: Kazuo ARITA, Masato OTSU, Yu ASANO, Etsuko SUZUKI
  • Patent number: 11760711
    Abstract: The invention provides an epoxy compound A represented by the following formula (1): in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: September 19, 2023
    Assignee: DIC Corporation
    Inventors: Kazuo Arita, Masato Otsu, Etsuko Suzuki
  • Patent number: 11117873
    Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: September 14, 2021
    Assignee: DIC Corporation
    Inventors: Kazuo Arita, Tomohiro Shimono, Masato Otsu, Junji Yamaguchi, Etsuko Suzuki
  • Patent number: 11104788
    Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: August 31, 2021
    Assignee: DIC Corporation
    Inventors: Masato Otsu, Kazuo Arita, Etsuko Suzuki, Junji Yamaguchi, Tomohiro Shimono
  • Patent number: 11001449
    Abstract: A conveyor belt includes core layers made of fabric disposed between an upper cover rubber and a lower cover rubber. At least one core layer has a strength in the belt width direction ranging from 30% to 70% of a strength in the belt longitudinal direction.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: May 11, 2021
    Inventors: Etsuko Suzuki, Atsushi Miyajima
  • Publication number: 20200331832
    Abstract: The invention provides an epoxy compound A represented by the following formula (1): in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).
    Type: Application
    Filed: November 20, 2018
    Publication date: October 22, 2020
    Inventors: Kazuo Arita, Masato Otsu, Etsuko Suzuki
  • Publication number: 20200109276
    Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.
    Type: Application
    Filed: December 14, 2017
    Publication date: April 9, 2020
    Inventors: Masato Otsu, Kazuo Arita, Etsuko Suzuki, Junji Yamaguchi, Tomohiro Shimono
  • Patent number: 10239695
    Abstract: A conveyor belt includes an upper cover rubber and a lower cover rubber disposed above and below a core layer; and a protective fiber layer made from high strength fiber disposed at least in a central portion of the upper cover rubber in a belt width direction and extending continuously in a belt longitudinal direction; an elastic modulus E of the protective fiber layer in the belt longitudinal direction being a low elastic modulus E1 equal to or less than a predetermined value when a tension in the belt longitudinal direction acting on the conveyor belt is equal to or less than a setting tension Ts, and being a high elastic modulus E2 higher than the low elastic modulus E1 when a predetermined high tension higher than the setting tension Ts is acting on the conveyor belt.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: March 26, 2019
    Assignee: The Yokohama Rubber Co., LTD.
    Inventors: Atsushi Miyajima, Etsuko Suzuki
  • Publication number: 20180362480
    Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.
    Type: Application
    Filed: November 24, 2016
    Publication date: December 20, 2018
    Applicant: DIC Corporation
    Inventors: Kazuo ARITA, Tomohiro SHIMONO, Masato OTSU, Junji YAMAGUCHI, Etsuko SUZUKI
  • Publication number: 20180194559
    Abstract: A conveyor belt includes core layers made of fabric disposed between an upper cover rubber and a lower cover rubber. At least one core layer has a strength in the belt width direction ranging from 30% to 70% of a strength in the belt longitudinal direction.
    Type: Application
    Filed: June 16, 2016
    Publication date: July 12, 2018
    Inventors: Etsuko Suzuki, Atsushi Miyajima
  • Publication number: 20180194560
    Abstract: A conveyor belt includes an upper cover rubber and a lower cover rubber disposed above and below a core layer; and a protective fiber layer made from high strength fiber disposed at least in a central portion of the upper cover rubber in a belt width direction and extending continuously in a belt longitudinal direction; an elastic modulus E of the protective fiber layer in the belt longitudinal direction being a low elastic modulus E1 equal to or less than a predetermined value when a tension in the belt longitudinal direction acting on the conveyor belt is equal to or less than a setting tension Ts, and being a high elastic modulus E2 higher than the low elastic modulus E1 when a predetermined high tension higher than the setting tension Ts is acting on the conveyor belt.
    Type: Application
    Filed: June 16, 2016
    Publication date: July 12, 2018
    Inventors: Atsushi Miyajima, Etsuko Suzuki
  • Patent number: 9963544
    Abstract: The present invention provides an active ester resin containing a phosphorus atom capable of providing a cured product having all of flame retardancy, heat resistance, and dielectric characteristics, an epoxy resin composition containing the same as a curing agent, a cured product thereof, a prepreg, a circuit board, and a build-up film. The active ester resin containing a phosphorus atom has Structure (I) in which a structural unit (?) in which a plurality of aromatic nuclei (X) are connected through an alicyclic hydrocarbon group is connected with another structural unit (?) through an arylene dicarbonyloxy group, and, at least one of the aromatic nuclei (X) present in the resin has a structural site (Y) represented by any one of the following Structural Formulas (y1) to (y4) as a substituent on the aromatic nucleus.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: May 8, 2018
    Assignee: DIC Corporation
    Inventors: Kazuo Arita, Etsuko Suzuki
  • Publication number: 20160130391
    Abstract: The present invention provides an active ester resin containing a phosphorus atom capable of providing a cured product having all of flame retardancy, heat resistance, and dielectric characteristics, an epoxy resin composition containing the same as a curing agent, a cured product thereof, a prepreg, a circuit board, and a build-up film. The active ester resin containing a phosphorus atom has Structure (I) in which a structural unit (?) in which a plurality of aromatic nuclei (X) are connected through an alicyclic hydrocarbon group is connected with another structural unit (?) through an arylene dicarbonyloxy group, and, at least one of the aromatic nuclei (X) present in the resin has a structural site (Y) represented by any one of the following Structural Formulas (y1) to (y4) as a substituent on the aromatic nucleus.
    Type: Application
    Filed: February 6, 2014
    Publication date: May 12, 2016
    Inventors: Kazuo Arita, Etsuko Suzuki
  • Patent number: 9217053
    Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: December 22, 2015
    Assignee: DIC Corporation
    Inventors: Etsuko Suzuki, Kazuo Arita
  • Publication number: 20150118499
    Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.
    Type: Application
    Filed: March 19, 2013
    Publication date: April 30, 2015
    Inventors: Etsuko Suzuki, Kazuo Arita
  • Patent number: 8791214
    Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: July 29, 2014
    Assignee: DIC Corporation
    Inventors: Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga, Kazuo Arita
  • Publication number: 20140151094
    Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).
    Type: Application
    Filed: May 25, 2012
    Publication date: June 5, 2014
    Applicant: DIC Corporation
    Inventors: Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga, Kazuo Arita
  • Patent number: 8669333
    Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: March 11, 2014
    Assignee: DIC Corporation
    Inventors: Kazuo Arita, Etsuko Suzuki