Patents by Inventor Etsuo Egashira

Etsuo Egashira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of treating semiconductor wafers
    Patent number: 3951728
    Abstract: A method of treating wafers, wherein a plurality of wafers are stacked and immersed in an etchant, to work, i.e., etch, the peripheral surfaces of the wafers. Sliced semiconductor wafers or metallic or ceramic wafers can be chemically chamfered in this manner.
    Type: Grant
    Filed: July 30, 1974
    Date of Patent: April 20, 1976
    Assignee: Hitachi, Ltd.
    Inventors: Etsuo Egashira, Shinichiro Miyoshi, Yukio Takei, Masato Fujita