Abstract: A wafer to be chamfered is supported in such a manner as to rotate and to move in the X-axis direction and the Y-axis direction which are perpendicular to one another, and a periphery grinding wheel is rotatably placed on the Y-axis. To chamfer a circular part of the wafer, the circular part of the wafer is pressed against the rotating periphery grinding wheel, and then, the wafer is rotated. To chamfer an orientation flat of the wafer, the orientation flat of the wafer is pressed against the rotating periphery grinding wheel, and then, the wafer is fed in the X-axis direction.

Abstract: The purpose of the test method is to improve test efficiency in a semiconductor test method utilizing multiprobing. The semiconductor test method involves placing probes into contact with the electrode pads of semiconductor chips on a semiconductor wafer with a test head providing and receiving test signals through the probes thereby checking the electrical properties of the semiconductor chips sequentially. According to the test method, in order to test a plurality of adjacent semiconductor chips simultaneously, as many probes are provided as the number of semiconductor chips to be tested simultaneously, the test head is capable of providing and receiving test signals for the plurality of semiconductor chips simultaneously, and the number of semiconductor chips that are tested simultaneously is determined without being limited to a power of 2.