Abstract: It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible.

Abstract: A heat dissipating wiring board includes a metal wiring plate with a circuit pattern formed therein, a filler containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed, and a heat dissipating plate arranged on an under surface of the filler containing resin layer. The circuit pattern is formed of a through groove provided in the metal wiring plate. The through groove includes a fine groove that opens at the top surface of the metal wiring plate and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to dust or the like in a space of the through groove.

Abstract: A PDP (plasma display panel) is attached to an electrically conductive board with a heat dissipation sheet sandwiched therebetween. A first driving circuit board is fixed on the electrically conductive board by a plurality of electrically conductive supports. On one surface, which faces the electrically conductive board, of the first driving circuit board, one or a plurality of electronic components are mounted, while a second driving circuit board is fixed. A plurality of support terminals of the second driving circuit board are connected to the first driving circuit board, and the first driving circuit board is attached to the electrically conductive board by the electrically conductive supports. Thus, one surface of the second driving circuit board is in contact with the electrically conductive board. One or a plurality of surface mount components are mounted on the other surface of the second driving circuit board that faces the first driving circuit board.

Abstract: It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible.

Abstract: A heat dissipating wiring board comprises: a metal wiring plate with a circuit pattern formed therein: a filler-containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed; and a heat dissipating plate arranged on an under surface of the filler-containing resin layer, wherein the circuit pattern is formed of a through groove provided in the metal wiring plate, and this through groove comprises: a fine groove that opens at the top surface of the metal wiring plate; and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to a dust or the like in a space of the through groove.

Abstract: A PDP (600) is attached to an electrically conductive board (31) with a heat dissipation sheet (60) sandwiched therebetween. A first driving circuit board (32) is fixed on the electrically conductive board (31) by a plurality of electrically conductive supports (34). On one surface, which faces the electrically conductive board (31), of the first driving circuit board (32), one or plurality of electronic components are mounted while a second driving circuit board (40) is fixed. A plurality of support terminals (43b) of the second driving circuit board (40) are connected to the first driving circuit board (32), and the first driving circuit board (32) is attached to the electrically conductive board (31) by the electrically conductive supports (34). Thus, one surface of the second driving circuit board (40) is in contact with the electrically conductive board (31).

Abstract: In a power conversion module device of the present invention, a transformer, a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reducing impedance and loss in the wiring, this constitution improves the voltage waveform of the primary power element. Thus, noise reduction can be achieved. Further, because heat can be transferred to the printed wiring board, heat generated from the transformer, the primary power element and the secondary power element can be reduced. The size of the transformer can also be reduced.

Abstract: In a power conversion module device of the present invention, transformer (11), primary power element (14), and secondary power element (15) are mounted on printed wiring board (16) in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reduction in impedance and loss in the wiring, this constitution improves the voltage waveform of primary power element (14). Thus, noise reduction can be achieved. Further, because heat can be transferred to printed wiring board (16), heat generated from transformer (11), primary power element (14), and secondary power element (15) can be reduced. The size of the transformer can also be reduced.

Abstract: An inexpensive highly reliable power supply for small-sized electronic devices, in which any high-withstand-voltage diode which has been used conventionally is not used and reverse leak currents are prevented. A series circuit of a primary-side coil (34) of a switching transformer and a switching element (35) is connected between both ends of an input power source (31) and a series circuit composed of a resistor (32) and a capacitor (33) is also connected between both ends of the power source (31). The connecting point between the resistor (32) and capacitor (33) is connected to one end of the control winding (37) of the switching transformer and the other end of the winding (37) of the transformer is connected to the control terminal of the switching element (35). A discharge circuit (40) which is driven by signals from the control winding (37) of the transformer is used as a means for discharging the capacitor (33).