Abstract: In the lead frame of the present invention, a common wiring portion (ground ring) is arranged around a die pad at a predetermined interval to be connected partially to the die pad, projection portions projected toward the die pad side are provided to side portions of the common wiring portion, a plurality of leads are provided away from the common wiring portion to extend outward from a periphery of the common wiring portion, and the projection portions of the common wiring portion are pressed partially by the die upon cutting off the leads from the common wiring portion by a die.

Abstract: In the lead frame of the present invention, a common wiring portion (ground ring) is arranged around a die pad at a predetermined interval to be connected partially to the die pad, projection portions projected toward the die pad side are provided to side portions of the common wiring portion, a plurality of leads are provided away from the common wiring portion to extend outward from a periphery of the common wiring portion, and the projection portions of the common wiring portion are pressed partially by the die upon cutting off the leads from the common wiring portion by a die.

Abstract: In a lead frame, a die-pad is delimited for a semiconductor element to be mounted thereon, a plurality of leads are arranged along the periphery of an area to be ultimately separated as a semiconductor device for the die-pad, and furthermore, a conductor portion for power/ground terminal is formed around the die-pad in the area between the die-pad and the leads corresponding to the die-pad. The die-pad, the leads, and the conductor portion for power/ground terminal are supported by an adhesive tape. The conductor portion for power/ground terminal is formed in the form of a single or double rings around the corresponding die-pad, or formed to partially surround the corresponding die-pad. The conductor portion for power/ground terminal is connected to at least one lead among the plurality of leads.