Patents by Inventor Etsuro Sasaki

Etsuro Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5590878
    Abstract: The number of parts is decreased for reducing costs. When a transport unit 70 and an introduction unit 80 are connected, if problems occur because of the outer frame dimension difference between gaming machines 11 or a combination of a gaming machine 11 and a pachinko ball lending machine 20, the transport unit 70 and the introduction unit 80 are expanded or contracted in a transport direction. If the transport unit 70 and the introduction unit 80 are set to a predetermined length, then both the units are fixed by adjustment screws 85b and 86b. This eliminates the need for manufacturing new transport units 70 or introduction units 80 of different types.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: January 7, 1997
    Assignee: Kabushiki Kaisha Ace Denken
    Inventors: Takatoshi Takemoto, Hideyuki Kadomatsu, Etsuro Sasaki
  • Patent number: 5501446
    Abstract: A paper strip transporting apparatus includes a drive pulley and a driven pulley (22, 23) which are separated from each other; a belt (25) which is disposed between and around the pulleys; a plurality of transporting rollers (27, 28) disposed along the belt (25) between the drive and driven pulleys (22, 23); and a drive unit (21) for driving drive pulley (22). Either one of the transporting rollers (27, 28) and the belt (25) has a convex portion and the other has a concave portion corresponding thereto at respective facing areas thereof. The transporting rollers (27, 28) are disposed with respect to the belt (25) so that the convex portion is positioned within the concave portion in a non-contacting relationship therebetween.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: March 26, 1996
    Assignee: Kabushiki Kaisha Ace Denken
    Inventors: Takatoshi Takemoto, Koichi Tsubota, Hideyuki Kadomatsu, Etsuro Sasaki
  • Patent number: 4327399
    Abstract: A heat pipe structure comprises a wiring substrate consisting of ceramic or silicon having a cavity in the interior on the inner surface of which is formed a wick and which contains working fluid, and radiating fins formed at the end of the substrate. Integrated circuit elements, integrated circuits or integrated circuit devices are securely inserted in holes which are formed on the surface or the back of the substrate and which communicate with the cavity so that the wick on their backs is aligned with the wick on the inner surface of the cavity for directly cooling the integrated circuit elements, the integrated circuits or the integrated circuit devices.
    Type: Grant
    Filed: December 27, 1979
    Date of Patent: April 27, 1982
    Assignee: Nippon Telegraph & Telephone Public Corp.
    Inventors: Etsuro Sasaki, Takaaki Ohsaki