Patents by Inventor Etsuro Udagawa

Etsuro Udagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing multilayer ceramic circuit board with copper
    Patent number: 4679320
    Abstract: A process for producing a multilayer ceramic circuit board with copper including the steps of:forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO.sub.2 -B.sub.2 O.sub.3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.
    Type: Grant
    Filed: November 26, 1985
    Date of Patent: July 14, 1987
    Assignee: Fujitsu Limited
    Inventors: Yoshihiko Imanaka, Hiromi Ogawa, Mineharu Tsukada, Etsuro Udagawa, Kazuaki Kurihara, Hiromitsu Yokoyama, Nobuo Kamehara