Patents by Inventor Etsuya Taki

Etsuya Taki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10661497
    Abstract: An object of the present invention is to provide a heat shrink tube excellent in peelability and transparency, and a method for producing the heat shrink tube. The present invention provides a peelable heat shrink tube comprising a composition containing a melt-processable fluororesin and PTFE, the PTFE lacking a heat history of its melting point or higher after polymerization and having a specific gravity, as measured according to ASTM D4894, of 2.20 or less. The content of the PTFE is 0.05 to 3.0 wt % based on the total weight of the melt-processable fluororesin and the PTFE. The present invention also provides a method for producing the tube which comprises melt-extruding the composition at a temperature lower than the melting point of the PTFE.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: May 26, 2020
    Assignees: NISSEI ELECTRIC CO., LTD., DUPONT-MITSUI FLUORCHEMICALS CO., LTD.
    Inventors: Hideki Kikuchi, Tetsuto Nakajima, Daisuke Tanaka, Takao Nishio, Etsuya Taki, Hoai-Nam Pham
  • Publication number: 20180186062
    Abstract: An object of the present invention is to provide a heat shrink tube excellent in peelability and transparency, and a method for producing the heat shrink tube. The present invention provides a peelable heat shrink tube comprising a composition containing a melt-processable fluororesin and PTFE, the PTFE lacking a heat history of its melting point or higher after polymerization and having a specific gravity, as measured according to ASTM D4894, of 2.20 or less. The content of the PTFE is 0.05 to 3.0 wt % based on the total weight of the melt-processable fluororesin and the PTFE. The present invention also provides a method for producing the tube which comprises melt-extruding the composition at a temperature lower than the melting point of the PTFE.
    Type: Application
    Filed: June 15, 2016
    Publication date: July 5, 2018
    Applicants: NISSEI ELECTRIC CO., LTD., DUPONT-MITSUI FLUOROCHEMICALS CO., LTD.
    Inventors: Hideki KIKUCHI, Tetsuto NAKAJIMA, Daisuke TANAKA, Takao NISHIO, Etsuya TAKI, Hoai-Nam PHAM
  • Publication number: 20080311358
    Abstract: A fluorine resin laminated substrate according to the present invention is a fluorine resin laminated substrate provided with multiple substrates on which circuit patterns are formed, and adhesive layers that adhere the multiple substrates together; wherein, the substrates are composed of a prepreg formed by impregnating a reinforcing fiber sheet with a first fluorine resin mixture, the adhesive layers are composed of a film of a second fluorine resin mixture, and the second fluorine resin mixture is a heat-meltable fluorine resin mixture having a melting point lower than the first fluorine resin mixture.
    Type: Application
    Filed: December 5, 2006
    Publication date: December 18, 2008
    Inventors: Akira Tomii, Takayoshi Ohno, Etsuya Taki
  • Patent number: 7439200
    Abstract: An improved circuit substrate is provided wherein glass cloth is completely embedded within fluoropolymer by thermocompression to form a composite structure, which when containing an adhesive agent such as the combination of functional groups and liquid crystal polymer is self-adhering to a metal layer such as of copper.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: October 21, 2008
    Assignee: DuPont-Mitsui Fluorochemicals Co. Ltd.
    Inventors: Jeong Chang Lee, Etsuya Taki
  • Publication number: 20070292685
    Abstract: Perfluoropolymer made without ionic species, initiator and without halocarbon solvent polymerization medium and dispersing agent is beneficially useful in liquid contact or food contact applications, for high-speed melt extrusion wire coating, and to produce insulated wire exhibiting low dissipation factor at high signal frequencies.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 20, 2007
    Inventors: Paul Brothers, John Netta, Charles Noelke, Philip Smith, Etsuya Taki, Patricia Tooley
  • Publication number: 20070049146
    Abstract: An improved circuit substrate is provided wherein glass cloth is completely embedded within fluoropolymer by thermocompression to form a composite structure, which when containing an adhesive agent such as the combination of functional groups and liquid crystal polymer is self-adhering to a metal layer such as of copper.
    Type: Application
    Filed: August 17, 2006
    Publication date: March 1, 2007
    Inventors: Jeong Lee, Etsuya Taki