Patents by Inventor Eugen HAUMANN

Eugen HAUMANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
    Patent number: 9924601
    Abstract: A method for the at least portion-wise and adhesive metallization of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallized, within an area to be metallized that is enclosed by one or more limiting lines, by molding a tool that is microstructured in accordance with the regions to be metallized within a molding area.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: March 20, 2018
    Assignee: LPKF LASER & ELECTRONICS AG
    Inventors: Roman Ostholt, Robin Alexander Krueger, Bernd Roesener, Eugen Haumann
  • METHOD FOR THE METALLATION OF A WORKPIECE AND A LAYER STRUCTURE MADE UP OF A WORKPIECE AND A METAL LAYER
    Publication number: 20160037650
    Abstract: A method for the at least portion-wise and adhesive metallisation of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallised, within an area to be metallised that is enclosed by one or more limiting lines, by moulding a tool that is microstructured in accordance with the regions to be metallised within a moulding area.
    Type: Application
    Filed: December 3, 2013
    Publication date: February 4, 2016
    Inventors: Roman OSTHOLT, Robin Alexander KRUEGER, Bernd ROESENER, Eugen HAUMANN