Abstract: Simulation system for selecting an alloy and a production process for a workpiece to be produced having amorphous properties, wherein the system includes : an input unit, for inputting a requirements profile for the workpiece to be produced, at least one memory unit, to store information data, wherein the information data specifies information concerning physical and/or chemical and/or mechanical properties of a number of alloys for manufacturing workpieces having amorphous properties and information concerning production processes, an analysis unit, to simulate a number of workpieces according to the requirements profile and the information data to create simulation data, to assess the simulated workpieces on the basis of the simulation data and the requirements profile, to select an alloy and a production process for the workpiece to be produced from assessment, and an output unit, to output the selected alloy and the selected production process.

Abstract: An inlet screen, arranged at the water inlet of a hydropower plant and comprises a plurality of elongated bars separated by a distance holding means, each elongated bar having in its elongation a proximal portion and a distal portion, and an upstream region and a downstream region, said regions being at an angle in relation to said proximal and distal portions, at least one of said bars defining a space extending along at least a portion of the elongation of said bar, said bar being provided. with an electric heating means. Said elongated bar has an elongated intermediate portion, said space being defined in either of the upstream region and the downstream region, said intermediate portion extending along the elongation of the bar between the upstream region and the downstream region, said electric heating means comprising at least one electric heating member.

Abstract: The invention relates to a system and method for indicating mechanical properties, and to a computer-readable storage medium, the system having a simulation unit which is designed to determine a cooling behavior of at least a part of a component to be produced, said component having amorphous properties, a computing unit which is designed to determine at least one amorphicity value at least for a part of the component to be produced, taking account of the determined cooling behavior, a prediction unit which is designed to indicate mechanical properties of the component to be produced, taking account of a geometry of the component to be produced, the at least one amorphicity value, at least one production parameter and/or a production method.

Abstract: Amorphous metals are a new class of materials in which advantageous physical properties can be achieved. Amorphous metals require rapid cooling in the injection-molding process, which is not achieved in the case of a large number of geometries. The invention relates to a method for adapting a component description of a workpiece to be produced with amorphous properties, which method comprises: —defining a cooling behaviour of at least a part of a workpiece to be produced, taking account of a component description of the workpiece; —adapting at least a part of the component description, taking account of the defined cooling behaviour of the workpiece.

Abstract: The invention relates to a method for producing a shaped part comprising a solid metallic glass. According to the method, a preform is shaped below the glass transition temperature and is then heated to a temperature above the glass transition temperature.

Abstract: One aspect relates to an injection molding system for the injection molding of amorphous metals, an injection molding unit for the injection molding of amorphous metals and an injection molding process for amorphous metals. The injection molding system includes a channel for feeding a molten metal and a slider unit including a slider and a pressure system. The slider is located between the channel and at least one injection molding cavity and is movable between a rest position and an injection position. In the rest position, the slider blocks the access of the molten metal to the injection molding cavity and in the injection position it allows the molten metal to access the injection molding cavity. The pressure system holds the slider in the rest position and allows the slider to move to the injection position when a minimum pressure is exceeded.

Abstract: A method for production of an ingot of a bulk glass-forming alloy, comprising the steps of: Providing a homogeneous melt of a bulk glass-forming alloy; casting the homogeneous melt into a casting mould, whereby the casting mould does not cool down below the glass-transition temperature of the alloy at the contact surface to the melt for at least 5 seconds; and cooling down the melt below the glass transition temperature of the bulk glass-forming alloy while obtaining the ingot.

Abstract: The present invention relates to an alloy which has the following composition: Cu47at %?(x+y+z)(TiaZrb)cNi7at %+xSn1at %+ySiz where c=43-47 at %, a=0.65-0.85, b=0.15-0.35, where a+b=1.00; x=0-7 at %; y=0-3 at %, z=0-3 at %, where y+z?4 at %.

Abstract: One aspect relates to an injection molding system for the injection molding of amorphous metals, an injection molding unit for the injection molding of amorphous metals and an injection molding process for amorphous metals. The injection molding system includes a channel for feeding a molten metal and a slider unit including a slider and a pressure system. The slider is located between the channel and at least one injection molding cavity and is movable between a rest position and an injection position. In the rest position, the slider blocks the access of the molten metal to the injection molding cavity and in the injection position it allows the molten metal to access the injection molding cavity. The pressure system holds the slider in the rest position and allows the slider to move to the injection position when a minimum pressure is exceeded.

Abstract: A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 ?m. The wire has a diameter in the range of from 100 ?m to 600 ?m and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.

Abstract: A process for manufacturing a bonding wire containing a core having a surface. The core contains ?98.0% copper and has a cross sectional area of 75,00 to 600,000 ?m2 and an elastic limit RP0.2 (yield strength) of 40 to 95 N/mm2. The process involves (a) providing a copper core precursor; (b) drawing the precursor until a final diameter of the wire core is reached; and (c) annealing the drawn wire at a minimum annealing temperature of 650 to 1000° C. through its entire cross section for a minimum annealing time of 4 seconds to 2 hours.

Abstract: A copper wire having a diameter of 10 to 80 ?m is provided. The copper wire bulk material is ?99.99 wt.-% pure copper or a copper alloy consisting of 10 to 1000 wt.-ppm of silver and/or of 0.1 to 3 wt.-% of palladium with copper as the remainder to make up 100 wt.-%, and the copper wire has a 0.5 to <6 nm thin circumferential surface layer of copper oxide.

Abstract: An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %.

Abstract: A bonding wire according to the invention contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver and the coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium. The coating layer is applied on the surface of the core by depositing a film of a liquid containing a coating component precursor onto a wire core precursor and heating the deposited film to decompose the coating component precursor into a metallic phase.

Abstract: The invention is related to a bonding wire containing a core having a surface. The core contains aluminum as a main component and scandium in an amount between 0.05% and 1.0%.

Abstract: The invention is related to a bonding wire containing a core having a surface. The core contains copper as a main component, an average size of crystal grains in the core is between 2.5 ?m and 30 ?m, and a yield strength of the bonding wire is less than 120 MPa.

Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.

Abstract: The invention is related to a bonding wire which contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver. The coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium in an amount of at least 10% and further contains the core main component in an amount of at least 10%.

Abstract: A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an intermediate layer. In a cross-sectional view of the ribbon, the area share of the first layer is from 50 to 96% and the aspect ratio between the width and the height of the ribbon in a cross-sectional view is from 0.03 to less than 0.8. The ribbon has a cross-sectional area of 25,000 ?m2 to 800,000 ?m2. The intermediate layer contains at least one intermetallic phase containing materials of the first and coating layers. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing the wire, to a propelled device comprising said electric device and to a process of connecting two elements through the wire by wedge-bonding.

Abstract: The invention is related to a bonding wire containing a core having a surface. The core contains aluminum as a main component and scandium in an amount between 0.05% and 1.0%.