Abstract: A Click Conversion Score (CCS) is a tool to provide a new “Ad-Exchange” for connecting Publishers and Advertisers in the Pay-per-Click advertising market. The CCS provides checks and balances into the Ad-Exchange by assessing the quality of traffic each Publisher provides Advertisers using an adaptive, multi-dimensional profiling system. This assessment is directly used in the charges billed the Advertisers. The score is adaptive, and highly dependent on the conversion feedback loop provided by Advertisers. A CCS system scores each Click and each resulting Conversion an Advertiser receives from the Ad-Exchange. In the preferred implementation, the score reflects a ratio of the measured conversion rate for a Publisher's traffic with the “expected” conversion rate based upon Advertisers histories.

Abstract: A Click Conversion Score (CCS) is a tool to provide a new “Ad-Exchange” for connecting Publishers and Advertisers in the Pay-per-Click advertising market. The CCS provides checks and balances into the Ad-Exchange by assessing the quality of traffic each Publisher provides Advertisers using an adaptive, multi-dimensional profiling system. This assessment is directly used in the charges billed the Advertisers. The score is adaptive, and highly dependent on the conversion feedback loop provided by Advertisers. A CCS system scores each Click and each resulting Conversion an Advertiser receives from the Ad-Exchange. In the preferred implementation, the score reflects a ratio of the measured conversion rate for a Publisher's traffic with the “expected” conversion rate based upon Advertisers histories.

Abstract: A lead frame for use in solid state relays has a teardrop shaped frame. The frame has a small rounded portion connected to a large rounded portion. A power semiconductor is mounted in the large rounded portion. The teardrop shape eliminates sharp corners found in rectangular frames and allows heat to dissipate radially in all directions. More metal in close proximity to the power semiconductor, maintaining a lower aspect ratio of length to width, allows the semiconductor to run cooler at any given load. Several vent holes are located in the small rounded portion, which act as exhaust ports for the fumes generated in the heating stage of the solder re-flow, increasing solder coverage and improving reliability. The life of solder junctions utilizing the teardrop shaped lead frame which are subjected to temperature cycling while under load is increased, thus extending the life of the solid state relay.

Abstract: An improved semiconductor attachment method that works with mixed assemblies on printed circuit boards or ceramic substrates maintains reliability and reduces the amount of lead-based solders used. A soft solder layer, which may be high in lead content, is deposited on the terminations of a semiconductor die. The soft solder layer acts as a cushion, protecting the fragile semiconductor die from thermally induced stress. Conductor pads of the substrate are printed with a low melting point solder paste that is preferably lead-free. The semiconductor die, along with other electric components, are mounted on the proper conductor pads. The low melting point solder paste is reflowed, heating the substrate and the other electric components. As a result, the low melting point solder paste forms strong solid metal solder joints between the conductor pads of the substrate and the terminations of the semiconductor die and the other electric components.

Abstract: A lead frame for use in solid state relays has a teardrop shaped frame. The frame has a small rounded portion connected to a large rounded portion. A power semiconductor is mounted in the large rounded portion. The teardrop shape eliminates sharp corners found in rectangular frames and allows heat to dissipate radially in all directions. More metal in close proximity to the power semiconductor, maintaining a lower aspect ratio of length to width, allows the semiconductor to run cooler at any given load. Several vent holes are located in the small rounded portion, which act as exhaust ports for the fumes generated in the heating stage of the solder re-flow, increasing solder coverage and improving reliability. The life of solder junctions utilizing the teardrop shaped lead frame which are subjected to temperature cycling while under load is increased, thus extending the life of the solid state relay.

Abstract: Instead of soldering a circuit board or substrate to a nickel-plated aluminum heat sink for solid state relay applications, the present invention utilizes ultrasonic welding to weld a copper foil to a non-nickel-plated aluminum heat sink. The circuit board or substrate is subsequently soldered to the copper foil. The superior solderability of copper foil brings increased solder coverage between the heat sink and substrate, improving the heat transfer from the output switching element to the heat sink. This method eliminates the need for fixturing since the copper foil is surrounded by non-nickel-plated aluminum that is non-solderable by commonly used solders. This method also eliminates the high costs associated with nickel-plating and hazardous waste disposal, since no chemical wastes are produced. With this method, the same size solid state relay is now able to carry more current due to the better heat transfer and heat dissipation capabilities.