Patents by Inventor Eugen Unger
Eugen Unger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8216639Abstract: One embodiment of the present invention provides a method for the deposition of a Carbon containing layer on a Silicon surface wherein a (i) substantially Silicon-oxide-free or reduced oxide interface results between Silicon and the Carbon containing layer during the deposition. In another embodiment, the present invention provides a method for deposition of a Carbon containing layer wherein the deposition process is substantially soot (particle)-free or reduction of soot.Type: GrantFiled: December 16, 2005Date of Patent: July 10, 2012Assignee: Qimonda AGInventors: Maik Liebau, Franz Kreupl, Georg Duesberg, Eugen Unger
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Patent number: 7807563Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.Type: GrantFiled: April 12, 2007Date of Patent: October 5, 2010Assignee: Infineon Technologies AGInventors: Zvonimir Gabric, Werner Pamler, Guenther Schindler, Gernot Steinlesberger, Andreas Stich, Martin Traving, Eugen Unger
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Patent number: 7731928Abstract: A process for silanizing carbon nanotubes, wherein the carbon nanotubes are oxidized and subsequently exposed to a saturated gas phase including one or more organosilane derivatives which form covalent bonds to the carbon nanotubes with siloxane formation.Type: GrantFiled: April 21, 2005Date of Patent: June 8, 2010Assignee: Qimonda AGInventors: Georg Duesberg, Maik Liebau, Eugen Unger
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Patent number: 7500369Abstract: The invention consists of a unit 10 including a two-piece, snap together housing made of elements 40 and 50 which forms the orifice seat and the transitions which direct moisture away from the seat area and prevents the accumulation of moisture in the seat area. Left-Hand (LH) housing 50 contains a blind journal and right-hand (RH) housing portion 40 contains a through journal for support and location of the gate 60. Also integral to the RH housing portion 40 are bosses for attaching the snap action switches 80, which determine gate orientation and mounting a gear motor 90, and can generally be referenced as “gate position sensors”. Such switches could also be replaced with other gate position sensors such as know in the art such as hall effect switches, magnetic switches, optical devices, etc. The gear motor provides the driving torque to the gate 60 through a cam-coupling 70, which has four switch detents 71, oriented to an internal shaft indexing means.Type: GrantFiled: August 4, 2006Date of Patent: March 10, 2009Assignee: Mid-South Products Engineering, Inc.Inventors: Larry Eugene Unger, Mike Nick Glavaris, Jr.
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Publication number: 20080315430Abstract: A method of fabricating an integrated circuit including arranging a nanowire with a first end portion thereof at a first contact surface of a first electrical contact and with a second end portion sticking up from the first contact surface, and embedding at least part of the nanowire in dielectric material.Type: ApplicationFiled: June 22, 2007Publication date: December 25, 2008Applicant: QIMONDA AGInventors: WALTER M. WEBER, Franz Kreupl, Eugen Unger
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Publication number: 20070246831Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.Type: ApplicationFiled: April 12, 2007Publication date: October 25, 2007Inventors: Zvonimir Gabric, Werner Pamler, Guenther Schindler, Gernot Steinlesberger, Andreas Stich, Martin Traving, Eugen Unger
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Publication number: 20070248523Abstract: A process for silanizing carbon nanotubes, wherein the carbon nanotubes are oxidized and subsequently exposed to a saturated gas phase including one or more organosilane derivatives which form covalent bonds to the carbon nanotubes with siloxane formation.Type: ApplicationFiled: April 21, 2005Publication date: October 25, 2007Applicant: QIMONDA AGInventors: Georg Duesberg, Maik Liebau, Eugen Unger
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Publication number: 20070218677Abstract: A method for forming self-aligned air-gaps as IMD wherein the interconnect lines are covered with self-aligned capping layer and wherein the process of forming the capping layer is a maskless process is provided.Type: ApplicationFiled: March 15, 2006Publication date: September 20, 2007Inventors: Manfred Engelhardt, Andreas Stich, Eugen Unger
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Publication number: 20070216030Abstract: An integrated circuit having a multilayer capacitance arrangement and a method for producing an integrated circuit having a multilayer capacitance arrangement are disclosed.Type: ApplicationFiled: February 15, 2007Publication date: September 20, 2007Applicant: INFINEON TECHNOLOGIES AGInventors: Guenther Schindler, Eugen Unger, Wolfgang Hoenlein
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Publication number: 20070141256Abstract: One embodiment of the present invention provides a method for the deposition of a Carbon containing layer on a Silicon surface wherein a (i) substantially Silicon-oxide-free or reduced oxide interface results between Silicon and the Carbon containing layer during the deposition. In another embodiment, the present invention provides a method for deposition of a Carbon containing layer wherein the deposition process is substantially soot (particle)-free or reduction of soot.Type: ApplicationFiled: December 16, 2005Publication date: June 21, 2007Inventors: Maik Liebau, Franz Kreupl, Georg Dusber, Eugen Unger
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Patent number: 7183131Abstract: A process for producing a nanoelement arrangement and to a nanoelement arrangement. A first nanoelement is at least partially covered with catalyst material for catalyzing the growth of nanoelements. Furthermore, at least one second nanoelement is grown on the catalyst material. Also, a nanoelement arrangement having a first nanoelement on which at least one predetermined region is covered with catalyst material for catalyzing the growth of nanoelements, and at least one second nanoelement grown on the catalyst material.Type: GrantFiled: November 12, 2003Date of Patent: February 27, 2007Assignee: Infineon Technologies AGInventors: Eugen Unger, Georg Stefan Dusberg, Andrew Graham, Maik Liebau
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Patent number: 7107775Abstract: The invention consists of a unit 10 including a two-piece, snap together housing made of elements 40 and 50 which forms the orifice seat and the transitions which direct moisture away from the seat area and prevents the accumulation of moisture in the seat area. Left-Hand (LH) housing 50 contains a blind journal and right-hand (RH) housing portion 40 contains a through journal for support and location of the gate 60. Also integral to the RH housing portion 40 are bosses for attaching the snap action switches 80, which determine gate orientation and mounting a gear motor 90, and can generally be referenced as “gate position sensors”. Such switches could also be replaced with other gate position sensors such as know in the art such as hall effect switches, magnetic switches, optical devices, etc. The gear motor provides the driving torque to the gate 60 through a cam-coupling 70, which has four switch detents 71, oriented to an internal shaft indexing means.Type: GrantFiled: June 25, 2004Date of Patent: September 19, 2006Assignee: Mid-South Products Engineering, Inc.Inventors: Larry Eugene Unger, Mike Nick Glavaris, Jr.
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Publication number: 20060174789Abstract: A structured, elastic stamp device is disclosed for producing the physical contact of the reactant with the substrate. More specifically, the device comprises a stamp device for carrying out soft-lithographic processes which comprises a base, which is produced from a polymer material, and at least one structured stamp surface of the base, which has a definable surface relief, the stamp surface being structured by means of an impression of a master element which has a defined primary surface relief.Type: ApplicationFiled: February 28, 2006Publication date: August 10, 2006Inventors: Maik Liebau, Eugen Unger
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Patent number: 6946386Abstract: A method of forming an ultrathin homogenous metal layer that serves as base metallization for formation of contact locations and/or contact pads and/or wirings of an integrated electronic component. The method includes the steps of depositing a first metal layer on a substrate at least in regions, and producing a second metal layer on the first metal layer at least in regions, component(s) of the second metal layer have a more positive redox potential than component(s) of the first metal layer, wherein ultrathin homogenous deposition of the second metal layer is effected by wet-chemical, current-free, electrochemical redox processes by element exchange from one or more metal salts as oxidant with at least a top metal atomic layer of the first metal layer as reductant.Type: GrantFiled: May 25, 2004Date of Patent: September 20, 2005Assignee: Infineon Technologies AGInventors: Gernot Steinlesberger, Manfred Engelhardt, Eugen Unger
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Publication number: 20050148174Abstract: Process for contact-connection of carbon nanotubes as part of their integration in an electric circuit, wherein the nanotubes, after they have been applied to metallic interconnects of the electric circuit, are connected to the interconnects at contact locations by electroless metallization.Type: ApplicationFiled: November 3, 2004Publication date: July 7, 2005Applicant: Infineon Technologies AGInventors: Eugen Unger, Georg Dusberg, Franz Kreupl, Andrew Graham, Maik Liebau
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Publication number: 20050118342Abstract: A process for the selective and areal deposition of a catalyst is disclosed, which is intended for the growth of nanotubes, on an interconnect line in an integrated circuit or chip. The process includes providing an acidic or alkaline aqueous solution of the catalyst; applying the solution to the interconnect line; and removing the excess solution.Type: ApplicationFiled: November 3, 2004Publication date: June 2, 2005Inventors: Manfred Engelhardt, Gernot Steinlesberger, Eugen Unger
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Patent number: 6866891Abstract: A method for targeted deposition of a nanotube on a planar surface includes providing a ram made from elastomeric material and having a relief structure on its surface. A microfluid capillary system, with an inlet and an outlet, is then formed by applying the ram to a planar substrate. A dispersion of nanotubes is brought into contact with the inlet, thereby enabling capillary force to disperse the nanotubes. through the microfluid capillary system. The resulting dispersion of nanotubes is then dried and the ram removed.Type: GrantFiled: April 14, 2003Date of Patent: March 15, 2005Assignee: Infineon Technologies AGInventors: Maik Liebau, Eugen Unger, Georg Dusberg
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Publication number: 20050040847Abstract: The invention relates to a process for producing a nanoelement arrangement and to a nanoelement arrangement. In the process for producing a nanoelement arrangement, a first nanoelement is at least partially covered with catalyst material for catalyzing the growth of nanoelements. Furthermore, at least one second nanoelement is grown on the catalyst material.Type: ApplicationFiled: November 12, 2003Publication date: February 24, 2005Applicant: Infineon Technologies AGInventors: Eugen Unger, Georg Dusberg, Andrew Graham, Maik Liebau
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Publication number: 20040253806Abstract: A method of forming an ultrathin homogenous metal layer that serves as base metallization for formation of contact locations and/or contact pads and/or wirings of an integrated electronic component. The method includes the steps of depositing a first metal layer on a substrate at least in regions, and producing a second metal layer on the first metal layer at least in regions, component(s) of the second metal layer have a more positive redox potential than component(s) of the first metal layer, wherein ultrathin homogenous deposition of the second metal layer is effected by wet-chemical, current-free, electrochemical redox processes by element exchange from one or more metal salts as oxidant with at least a top metal atomic layer of the first metal layer as reductant.Type: ApplicationFiled: May 25, 2004Publication date: December 16, 2004Applicant: Infineon Technologies AGInventors: Gernot Steinlesberger, Manfred Engelhardt, Eugen Unger
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Publication number: 20040216955Abstract: A multipurpose ladder standoff especially useful for house painters and utility field workers including a jaw coupled between first and second rungs of an extension ladder and including first and second rotatable arms extending forwardly from opposing left and right jaw sides to encircle utility poles and trees, or to rest against the exterior walls and/or around the corners of a dwelling—all in a very stable, solid position.Type: ApplicationFiled: April 29, 2003Publication date: November 4, 2004Inventor: Eugene Unger