Abstract: The techniques described herein facilitate sharing electronic cloud-based calendars via online application and collaboration services, e.g., Microsoft Office 365®. In an implementation, a method of operating an online application and collaboration service for sharing electronic calendars between mailboxes is disclosed. The method includes receiving a request to share a master calendar owned by a first user of the online application and collaboration service with a second user. The master calendar is stored in the first user's mailbox. The method further includes communicating a response indicating acceptance of the request to share the master calendar, generating a copy of the master calendar in the second user's mailbox, and synching the copy of the master calendar with the master calendar using pre-cached data to populate an initial view.

Abstract: The techniques described herein facilitate sharing electronic cloud-based calendars via online application and collaboration services, e.g., Microsoft Office 365®. In an implementation, a method of operating an online application and collaboration service for sharing electronic calendars between mailboxes is disclosed. The method includes receiving a request to share a master calendar owned by a first user of the online application and collaboration service with a second user. The master calendar is stored in the first user's mailbox. The method further includes communicating a response indicating acceptance of the request to share the master calendar, generating a copy of the master calendar in the second user's mailbox, and synching the copy of the master calendar with the master calendar using pre-cached data to populate an initial view.

Abstract: An exemplary method includes forming a vertical pillar overlying or laterally displaced from a bond pad overlying a semiconductor substrate, and applying a discrete solder sphere in combination with one of a solder paste or flux on a top surface of the pillar, wherein the one of the solder paste or flux is defined by at least one photoresist layer. The method may include applying a solder sphere and/or solder flux in different combinations on top surfaces of different first and second pillars.

Abstract: Structures and methods provide a dielectric bridge for use in electroplating. A method comprises: providing a semiconductor wafer with a plurality of die, wherein a first die is adjacent to a second die, and the first die and second die are separated by a dicing street area; forming a patterned dielectric layer overlying the semiconductor wafer, the dielectric layer including a dielectric bridge that crosses the dicing street area; forming a conductive layer (e.g., a metal seed layer) overlying the dielectric layer, wherein a portion of the conductive layer is overlying the dielectric bridge to provide a current pathway from the first die to the second die; and electroplating targeted areas of the conductive layer by providing current to the second die using the current pathway. Other such bridges formed from the dielectric layer provide current pathways to other die on the wafer.

Abstract: Structures and methods provide a dielectric bridge for use in electroplating. A method comprises: providing a semiconductor wafer with a plurality of die, wherein a first die is adjacent to a second die, and the first die and second die are separated by a dicing street area; forming a patterned dielectric layer overlying the semiconductor wafer, the dielectric layer including a dielectric bridge that crosses the dicing street area; forming a conductive layer (e.g., a metal seed layer) overlying the dielectric layer, wherein a portion of the conductive layer is overlying the dielectric bridge to provide a current pathway from the first die to the second die; and electroplating targeted areas of the conductive layer by providing current to the second die using the current pathway. Other such bridges formed from the dielectric layer provide current pathways to other die on the wafer.