Abstract: Methods and computer program products for performing automatically determining when to shut down a fabrication tool, such as a semiconductor wafer fabrication tool, are provided herein. The methods include, for example, creating a measurement vector including process parameters of semiconductor wafers, creating a correlation matrix of correlations between measurements of parameters obtained of each wafer, creating autocorrelation matrixes including correlations between measurements of the parameter obtained for pairs of wafers; creating a combined matrix of correlation and autocorrelation matrixes, obtaining a T2 value from the measurement vector and combined matrix, and stopping a semiconductor wafer fabrication tool if the T2 value exceeds a critical value.

Abstract: Methods and computer program products for performing automatically determining when to shut down a fabrication tool, such as a semiconductor wafer fabrication tool, are provided herein. The methods include, for example, creating a measurement vector including process parameters of semiconductor wafers, creating a correlation matrix of correlations between measurements of parameters obtained of each wafer, creating autocorrelation matrixes including correlations between measurements of the parameter obtained for pairs of wafers; creating a combined matrix of correlation and autocorrelation matrixes, obtaining a T2 value from the measurement vector and combined matrix, and stopping a semiconductor wafer fabrication tool if the T2 value exceeds a critical value.

Abstract: Methods and computer program products for performing automatically determining when to shut down a fabrication tool, such as a semiconductor wafer fabrication tool, are provided herein. The methods include, for example, creating a measurement vector including process parameters of semiconductor wafers, creating a correlation matrix of correlations between measurements of parameters obtained of each wafer, creating autocorrelation matrixes including correlations between measurements of the parameter obtained for pairs of wafers; creating a combined matrix of correlation and autocorrelation matrixes, obtaining a T2 value from the measurement vector and combined matrix, and stopping a semiconductor wafer fabrication tool if the T2 value exceeds a critical value.

Abstract: Methods and computer program products for performing automatically determining when to shut down a fabrication tool, such as a semiconductor wafer fabrication tool, are provided herein. The methods include, for example, creating a measurement vector including process parameters of semiconductor wafers, creating a correlation matrix of correlations between measurements of parameters obtained of each wafer, creating autocorrelation matrixes including correlations between measurements of the parameter obtained for pairs of wafers; creating a combined matrix of correlation and autocorrelation matrixes, obtaining a T2 value from the measurement vector and combined matrix, and stopping a semiconductor wafer fabrication tool if the T2 value exceeds a critical value.

Abstract: Methods and processes for establishing a rework threshold for layers applied after thermal processing during fabrication of semiconductor devices are provided. One method includes, for instance: obtaining a device after at least one laser annealing process is completed, the device including a substrate surface and at least one layer over the substrate surface; performing lithography on the at least one layer; positioning a first contact-to-gate layer over the at least one layer; checking alignment of electrical connections between the substrate surface and the first contact-to-gate layer; determining if an overlay error is present; and adjusting at least one subsequent fabrication process pursuant to the overlay error.

Abstract: Thermal processing and alignment methods and processes used during fabrication of semiconductor devices are provided. One method includes, for instance: obtaining a device after at least one laser annealing process is completed, the device including a substrate surface and at least one layer over the substrate surface; applying a mask layer to the at least one layer; performing lithography on the mask layer to form a top layer; positioning a first contact-to-gate layer over the top layer; checking alignment of electrical connections between the substrate surface and the first contact-to-gate layer; and determining if an adjustment is needed to at least one parameter of at least one laser annealing beam used during the laser annealing process. In enhanced aspects, the at least one laser annealing process includes: performing three laser anneals; applying three mask layers; and performing lithography three times.

Abstract: Methods and processes for establishing a rework threshold for layers applied after thermal processing during fabrication of semiconductor devices are provided. One method includes, for instance: obtaining a device after at least one laser annealing process is completed, the device including a substrate surface and at least one layer over the substrate surface; performing lithography on the at least one layer; positioning a first contact-to-gate layer over the at least one layer; checking alignment of electrical connections between the substrate surface and the first contact-to-gate layer; determining if an overlay error is present; and adjusting at least one subsequent fabrication process pursuant to the overlay error.

Abstract: Thermal processing and alignment methods and processes used during fabrication of semiconductor devices are provided. One method includes, for instance: obtaining a device after at least one laser annealing process is completed, the device including a substrate surface and at least one layer over the substrate surface; applying a mask layer to the at least one layer; performing lithography on the mask layer to form a top layer; positioning a first contact-to-gate layer over the top layer; checking alignment of electrical connections between the substrate surface and the first contact-to-gate layer; and determining if an adjustment is needed to at least one parameter of at least one laser annealing beam used during the laser annealing process. In enhanced aspects, the at least one laser annealing process includes: performing three laser anneals; applying three mask layers; and performing lithography three times.

Abstract: A field deployable optical assembly for use in testing a light-responsive sample is disclosed. The assembly includes a microfluidic device, a first optical package, and a second optical package. The first optical package includes a light emitting diode (LED), a first optical device, and a first light-path control, the first optical package configured to guide and focus light from the LED onto the sample. The microfluidic device includes a tethered control substance. In response to a substance within the sample being associated with, and attaching to, the tethered control, the sample emits light. The second optical package includes a photo sensor, a second optical device, and a second light-path control, the second optical package configured to guide and focus the light emitted from the sample onto the photo sensor.

Abstract: A fluorescence detection system comprises a light source configured to produce an excitation light, an optical lens and a fiber bundle. The optical lens is configured to focus the excitation light to a sample to emit fluorescence and to collect the fluorescence. The fiber bundle probe comprises a transmitting fiber configured to transmit the excitation light to the optical lens, and a first receiving fiber configured to deliver the collected fluorescence. The fluorescence detection system further comprises a first detector configured to detect the fluorescence delivered by the receiving fiber to generate a response signal, and a processing unit configured to determine information about the samples by analyzing the response signal. Additionally, a fluorescence detection method is also presented.

Abstract: Disclosed herein are biosensors and methods for making and using the same. In one embodiment, the sensor for detecting an analyte comprises: a substrate, recognition elements specific for the analyte, an excitation source, a detector, a chamber located between the substrate and the excitation source and between the substrate and the detector, and an emission filter. The recognition elements are tethered to the substrate such that the recognition elements can be exposed to a sample. The excitation source is capable of emitting a first light having a first light peak intensity at a first wavelength, wherein the first light can excite a luminophore to emit a second light when the recognition elements interact with the analyte. The detector is capable of detecting the second light emitted by the luminophore. The emission filter is capable of filtering in a band gap that includes the first light peak intensity.

Abstract: A system and method for multimode imaging of at least one sample is disclosed. The system includes at least one light source; an optical system selected responsive to a mode of operation of the imaging system; and a detector capable of selective reading of pixels. The at least one sample is moved elative to the optical system using a sample movement technique selected from the group consisting of step sample moving and continuous sample moving. The method includes the steps of (1) selecting a mode of operation for the imaging system; (2) transmitting light from at least one light source through an optical system selected in response to the mode of operation for the imaging system; (3) moving the at least one sample relative to the optical system using a sample movement technique selected from the group consisting of step sample moving and continuous sample moving; and (4) selectively reading pixels with a detector.

Abstract: A device and method for detecting the presence of one or more analytes, bound directly or indirectly to a binding substrate functionalized with a fluorophore, based on measurements of fluorescence and reflectivity. The device and methods comprise an excitation source that emits light capable of being absorbed by a fluorophore and results in the fluorophore's excitation and emission, a fluorescent probe specific for the analyte that is attached via chemisorption to the binding substrate, a detector, and a processor adapted to determine the quantity of the one or more analytes present, by correlating measurements of reflected and fluorescent light.

Abstract: Methods and systems for detecting biological or biochemical analytes generally comprising, a metal film having one or more surfaces comprising one or more submicron structures; a device for applying one or more analytes to at least a portion of the film surface to interact with said metal film; a light source for illuminating a surface of the metal film so that at least some of the light is adapted to be optically altered by the functionalized metal film; and an optical detection subsystem for collecting the optically altered light, wherein the altered light is indicative of surface plasmon resonance on the film, and detecting one or more properties of the analytes based on the collected light.

Abstract: Disclosed herein are biosensors and methods for making and using the same. In one embodiment, the sensor for detecting an analyte comprises: a substrate, recognition elements specific for the analyte, an excitation source, a detector, a chamber located between the substrate and the excitation source and between the substrate and the detector, and an emission filter. The recognition elements are tethered to the substrate such that the recognition elements can be exposed to a sample. The excitation source is capable of emitting a first light having a first light peak intensity at a first wavelength, wherein the first light can excite a luminophore to emit a second light when the recognition elements interact with the analyte. The detector is capable of detecting the second light emitted by the luminophore. The emission filter is capable of filtering in a band gap that includes the first light peak intensity.

Abstract: A field deployable optical assembly for use in testing a light-responsive sample is disclosed. The assembly includes a microfluidic device, a first optical package, and a second optical package. The first optical package includes a light emitting diode (LED), a first optical device, and a first light-path control, the first optical package configured to guide and focus light from the LED onto the sample. The microfluidic device includes a tethered control substance. In response to a substance within the sample being associated with, and attaching to, the tethered control, the sample emits light. The second optical package includes a photo sensor, a second optical device, and a second light-path control, the second optical package configured to guide and focus the light emitted from the sample onto the photo sensor.

Abstract: A system and method for multimode imaging of at least one sample is disclosed. The system includes at least one light source; an optical system selected responsive to a mode of operation of the imaging system; and a detector capable of selective reading of pixels. The at least one sample is moved elative to the optical system using a sample movement technique selected from the group consisting of step sample moving and continuous sample moving. The method includes the steps of (1) selecting a mode of operation for the imaging system; (2) transmitting light from at least one light source through an optical system selected in response to the mode of operation for the imaging system; (3) moving the at least one sample relative to the optical system using a sample movement technique selected from the group consisting of step sample moving and continuous sample moving; and (4) selectively reading pixels with a detector.

Abstract: A smart biochip array comprises an array of test sites disposed on a substrate and a smart circuit operatively associated with the substrate. Each test site contains a distinct type of probe molecule, and the smart circuit includes a memory that stores data identifying which distinct type of molecule is stored in each test site. The test sites in the biochip array are exposed to a sample that may contain target molecules capable of binding with probe molecules contained in one or more test sites. A system for scanning the exposed smart biochip array includes a detector for detecting binding between probe molecules and target molecules in each test site and a reader for reading data from the smart circuit, including data identifying the type of probe molecules contained in each test site.