Abstract: Systems and methods for generating low or ultra-low concentrations of oil-based challenging compounds for filtration media are provided. Embodiments of the generators utilize bypass air in addition to the source of challenge. A HEPA filter which utilizes spunbond scrim material and ePTFE membrane for use in an aseptic pharmaceutical filtration air handling system for installation and testing is provided. The installation and testing configuration includes the ePTFE filter with a low or ultra-low concentration of challenging aerosol in the upstream side of the filter along with a scanning device for determining the upstream concentration, all completed in situ within a pharmaceutical air handling system. At the downstream side of the ePTFE filter is positioned another scanner which may be a discrete particle counter. The system and configuration allows for exposure to ePTFE filtration media for certification by low or ultra-low concentrations of oil based challenging compounds.

Abstract: Systems and methods for generating low or ultra-low concentrations of oil-based challenging compounds for filtration media are provided. Embodiments of the generators utilize bypass air in addition to the source of challenge. A HEPA filter which utilizes spunbond scrim material and ePTFE membrane for use in an aseptic pharmaceutical filtration air handling system for installation and testing is provided. The installation and testing configuration includes the ePTFE filter with a low or ultra-low concentration of challenging aerosol in the upstream side of the filter along with a scanning device for determining the upstream concentration, all completed in situ within a pharmaceutical air handling system. At the downstream side of the ePTFE filter is positioned another scanner which may be a discrete particle counter. The system and configuration allows for exposure to ePTFE filtration media for certification by low or ultra-low concentrations of oil based challenging compounds.

Abstract: Fabrication processes for manufacturing and connecting a semiconductor switching device are disclosed, including an embodiment for dicing a wafer into individual circuit die by sawing the interface between adjacent die with a saw blade that has an angled configuration across its width, preferably in a generally V-shape so that the adjacent die are severed from one another while simultaneously providing a beveled surface on the sides of each separated die. Another embodiment relates to the manner in which damage to a beveled side surface of the individual die can be smoothed by a chemical etching process.

Abstract: Fabrication processes for manufacturing and connecting a semiconductor switching device are disclosed, including an embodiment for dicing a wafer into individual circuit die by sawing the interface between adjacent die with a saw blade that has an angled configuration across its width, preferably in a generally V-shape so that the adjacent die are severed from one another while simultaneously providing a beveled surface on the sides of each separated die. Another embodiment relates to the manner in which damage to a beveled side surface of the individual die can be smoothed by a chemical etching process.