Abstract: A bracket assembly and method for attaching pin-in-hole components and daughter boards to a surface mount printed circuit board which alleviates the problem of the limited peel strength of the interconnect patterns on the surface of surface mount boards and also prevents these components from being subjected to the heat of soldering techniques such as reflow soldering.

Abstract: A fiber optic cable connection having easy cable insertion and greater pull strength is obtained by providing a cable connector (30) embodying a tapered, partially split sheath (38) around the cable (18) in a tapered hole (36) in the connector body (32) and a compression nut (34) for adjusting the compression of the partially split sheath (38). When the cable (18) is inserted, springy legs (42) on the tapered sheath (38) bend apart to allow easy insertion. When an attempt is made to withdraw the cable (18) ends (44) of legs (42) bite into the cable, resisting removal. The compression nut (34) permits disassembly of the connector (30) if desired and allows adjustment of the cable clamping force. The tapered sheath (38) may be easily removed without damage to the cable (18).

Abstract: An improved semiconductor device package and method include, in a first embodiment, a die supporting leadframe having fingers inside the package body which are interleaved with mating fingers of a metallic heat extractor, without touching. A thermally conductive encapsulation fills the spaces between and around the fingers to provide thermal coupling and electrical isolation. The heat extractor extends outside the package body. Alternatively, the heat extractor and the leadframe have large parallel faces inside the package body which are arranged in a face-to-face relationship, without touching. An insulating spacer locks the opposing faces in the spaced-apart, electrically isolated relationship. An encapsulation fills any remaining space between the faces to provide efficient thermal coupling.

Abstract: An improved vehicle height sensor and automotive leveling system are described using, in a preferred embodiment, two optical emitter-receiver pairs mounted in the sidewall or dust cover of a standard automotive air shock. The emitter-receiver pairs are arranged to operate by reflecting light from the central shaft of the shock absorber. Each emitter-receiver pair provides a light path that lies in a plane substantially perpendicular to the extension direction of the shock. The two emitter receiver pairs are spaced apart along the extension direction of the shock. Movement of the internal piston of the shock successively interrupts (by absorption) the light paths of the emitter-receiver pairs so as to provide a positive indication of the location of the movable piston and hence the height of the shock and the height of vehicle body above the road. The emitter-receiver pairs are mounted in a common assembly and seal to the shock dust cover through a single hole.

Abstract: A steering module assembly having a contoured housing unit to receive a PC board which has soldered to it a plurality of optoelectronic devices wherein neither said plurality of optoelectronic devices nor said PC board come in direct contact with the housing unit. The PC board also has a saddle element which contains snap retainers to receive each of said plurality of optoelectronic devices. A fitted cover encloses the housing unit.

Abstract: A package for optoelectronic devices is disclosed having means for receiving the end of an optical fiber. The package fastens to the fiber by means of a collet chuck which is part of the package. The chuck is closed by rotating a collar.

Abstract: An improved lead frame is provided for the manufacture of high heat dissipating semiconductor devices having a large heat sink metallic portion exposed with plastic encapsulating material partially disposed thereabout. A semiconductor unit is mounted directly on the heat sink such that high heat dissipation is obtained. The lead frame provides for pairs of metallic heat sink portions joined to a interdigitated center lead frame portion such that the interdigitation of the semiconductor device leads associated with each of the opposed heat sink portions provides for a high density lead frame structure from which a minimum of material must be removed in the fabrication process.