Abstract: A selective low noise amplifier (LNA) comprising an input hybrid coupler receives a first input and a second input and to provide a first output and a second output; and an output hybrid coupler receives a first input and a second input and to provide for at least one output. A first amplifier and a second amplifier, each respective amplifier in first and second parallel paths are couple to and between the first output and the second output, respectively, of the input hybrid coupler and the first input and the second input, respectively, of the output hybrid coupler. A phase controller coupled to at least one of the first input and the second input of the output hybrid coupler delays signals from the first and second inputs of the output hybrid coupler to the at least one output of the output hybrid coupler. A method is also disclosed.

Abstract: Embodiments are directed to a dynamic multi-mode radiometer system and method for automated calibration of the system. In an embodiment, the system comprises a radiometer channel including an input selective low noise amplifier (LNA) and radiometer receiver. The LNA comprises a first input and second input and an output coupled to the radiometer receiver. The system includes an antenna coupled to the first input and a reference load selectively connected to the second input, the reference load configured to produce a first signal representative of a reference temperature. The system includes an internal calibrated noise generator selectively connected to the second input of the LNA and includes an internal noise source for producing a second signal representative of an injected noise temperature. The generator is configured to calibrate the radiometer receiver as a function of the injected noise temperature equalized to the reference temperature.

Abstract: A full duplex communication system is capable of providing actual wireless transmission rates on the order of 125 Mb/s, or higher, with relatively high transmission power on the order of 0.5 to 2 watts (W) or higher, with a high signal-to-noise (S/N) ratio, a bit error rate on the order of 10?12 or lower, 99.99% availability, and with relatively simple circuit designs. A single compact and efficient, low distortion transceiver design is used based on high power (e.g., 0.5 W) monolithic millimeter wave integrated circuits (MMICs), having a compression point which accommodates high speed modems such as OC-3 and 100 Mb/s Fast Ethernet modems used in broadband networking technologies like SONET/SDH (e.g., SONET ring architectures having self-healing ring capability). By applying high power MMIC technology of conventional radar systems to wireless duplex communications, significant advantages can be realized in a fixed wireless spectrum of 18-40 GHz or wider.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A millimeter wave filter for surface mount applications includes at least one low temperature, co-fired ceramic layer defining an outer filter surface. A plurality of parallel, coupled line millimeter wavelength hairpin resonators, each formed from a single stripline or microstrip, are positioned on the outer filter surface. Each hairpin resonator is folded back upon itself into substantially parallel resonator lines.

Abstract: A subminiature coaxial connector (SMA) includes a shell, dielectric and conductor element that includes a biasing element that engages an interface contact tip and biases the interface contact tip into electrical contact against an electrical circuit, such as a trace on the circuit board without soldering, and adjusts for relative movements created by thermal mismatch.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A subminiature coaxial connector (SMA) includes a shell, dielectric and conductor element that includes a biasing element that engages an interface contact tip and biases the interface contact tip into electrical contact against an electrical circuit, such as a trace on the circuit board without soldering, and adjusts for relative movements created by thermal mismatch.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: The present invention is directed to an apparatus and method for varying the power level of a transmitted signal, such as a transmitted radio frequency signal, of high power, high transmission rate systems in a relatively straightforward, cost efficient manner. Exemplary embodiments can provide a range of stable DC control voltages for driving a power level attenuator, wherein the control voltages possess essentially no AC component (e.g., in exemplary embodiments, at a 5 volt DC output, virtually no AC component in the millivolt range is present), and possess a high current capability (e.g., at a 5 volt DC output exemplary embodiments can accommodate currents in excess of 0.5 amps (A) up to 7 A or greater).

Abstract: A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A subminiature coaxial connector (SMA) includes a shell, dielectric and conductor element that includes a biasing element that engages an interface contact tip and biases the interface contact tip into electrical contact against an electrical circuit, such as a trace on the circuit board without soldering, and adjusts for relative movements created by thermal mismatch.

Abstract: A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm microstrip interface line. A base plate is formed of a material that has a higher unmatched coefficient of thermal expansion (CTE) than the carrier board and supports same. A housing is mounted over the carrier board and engages the base plate. The housing has at least one subminiature coaxial connector (SMA) interface mounted thereon. A flexible circuit interconnect, such as a fuzz button, connects the subminiature coaxial connector and MMIC die through the interface line. A thermal interface member is positioned between the carrier board and base plate to aid in heat transfer between the base plate and housing and the lower CTE carrier board.

Abstract: A millimeter wave filter for surface mount applications includes a dielectric base plate having opposing surfaces. A ground plane layer is formed on a surface of the dielectric base plate. At least one low temperature co-fired ceramic layer is positioned over the ground plane layer and defines an outer filter surface. A plurality of coupled line millimeter wavelength resonators are formed as stripline or microstrip and positioned on the outer filter surface. These resonators can be parallel coupled line filters, including hairpin resonators. Radio frequency terminal contacts are positioned on the surface of the dielectric base plate opposite the at least one low temperature co-fired ceramic layer. Conductive vias extend through the at least one low temperature co-fired ceramic layer, ground plane and dielectric base plate and interconnect the radio frequency terminal contacts and coupled line resonator.

Abstract: The present invention is directed to providing a full duplex communication system capable of providing actual wireless transmission rates on the order of 125 Mb/s, or higher, with relatively high transmission power on the order of 0.5 to 2 watts (W) or higher, with a high signal-to-noise(S/N) ratio, a bit error rate on the order of 10−12 or lower, 99.99% availability, and with relatively simple circuit designs. Exemplary embodiments can provide these features using a single compact and efficient, low distortion transceiver design based on high power (e.g., 0.5 W) monolithic millimeter wave integrated circuits (MMICs), having a compression point which accommodates high speed modems such as OC-3 and 100 Mb/s Fast Ethernet modems used in broadband networking technologies like SONET/SDH (e.g., SONET ring architectures having self-healing ring capability). By applying high power MMIC technology of conventional radar systems to wireless duplex communications, significant advantages can be realized.