Patents by Inventor Eugene Gantvarg
Eugene Gantvarg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8079894Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.Type: GrantFiled: October 16, 2009Date of Patent: December 20, 2011Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Norman Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Publication number: 20100035526Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.Type: ApplicationFiled: October 16, 2009Publication date: February 11, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Norman Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Patent number: 7614939Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.Type: GrantFiled: June 7, 2007Date of Patent: November 10, 2009Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Norman Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Publication number: 20070238399Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.Type: ApplicationFiled: June 7, 2007Publication date: October 11, 2007Applicant: Applied Materials, Inc.Inventors: Robert Tolles, Norm Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Lee
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Patent number: 7255632Abstract: A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.Type: GrantFiled: January 10, 2006Date of Patent: August 14, 2007Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Norm Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Patent number: 7238090Abstract: Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing station is located between either two polishing stations or between a polishing station and a transfer station. Multiple carrier heads are supported by a support member that is rotatable about an axis. The transfer station and the multiple polishing stations are arranged at approximately equal angular intervals about the axis.Type: GrantFiled: October 13, 2004Date of Patent: July 3, 2007Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Norm Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Publication number: 20060194525Abstract: A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.Type: ApplicationFiled: January 10, 2006Publication date: August 31, 2006Inventors: Robert Tolles, Norm Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Lee
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Patent number: 7097544Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.Type: GrantFiled: February 18, 2000Date of Patent: August 29, 2006Assignee: Applied Materials Inc.Inventors: Robert D. Tolles, Norm Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Publication number: 20050142995Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.Type: ApplicationFiled: February 23, 2005Publication date: June 30, 2005Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
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Patent number: 6896584Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.Type: GrantFiled: September 17, 2003Date of Patent: May 24, 2005Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
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Publication number: 20050048880Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.Type: ApplicationFiled: October 13, 2004Publication date: March 3, 2005Inventors: Robert Tolles, Norm Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Lee
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Publication number: 20040063385Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.Type: ApplicationFiled: September 17, 2003Publication date: April 1, 2004Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
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Patent number: 6648740Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.Type: GrantFiled: September 19, 2002Date of Patent: November 18, 2003Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
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Patent number: 6532866Abstract: A multiple substrate orienter is provided that includes a rotatable substrate handler having a plurality of substrate support portions, each adapted to support a substrate. The multiple substrate orienter also includes a plurality of stacked substrate supports, each adapted to support a substrate. A plurality of substrate orientation marking (SOM) detectors are provided, and each SOM detector is coupled to a different one of the substrate supports and is adapted to identify a presence of an SOM of a substrate positioned close enough to the SOM detector to allow SOM detection by the SOM detector. The multiple substrate orienter further includes a plurality of lift and lower mechanisms, each lift and lower mechanism coupled to a different one of the substrate supports and adapted to individually lift and lower the substrate support to which the lift and lower mechanism is coupled. Numerous other aspects are provided.Type: GrantFiled: April 8, 2002Date of Patent: March 18, 2003Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Eugene Gantvarg, Leonid Tertitski
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Publication number: 20030022609Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.Type: ApplicationFiled: September 19, 2002Publication date: January 30, 2003Applicant: Applied Materials, Inc., a Delaware corporationInventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
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Patent number: 6506104Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the cuter portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.Type: GrantFiled: July 18, 2001Date of Patent: January 14, 2003Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
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Publication number: 20020170672Abstract: A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. Numerous other aspects are provided.Type: ApplicationFiled: July 11, 2002Publication date: November 21, 2002Inventors: Ilya Perlov, Alexey Goder, Eugene Gantvarg, Howard E. Grunes
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Patent number: 6468353Abstract: A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. In a second aspect, the substrate carriage is magnetically coupled so as to rotate and/or lift and lower magnetically, thereby reducing particle generation via contact between moving parts (and potential chamber contamination therefrom). In a third aspect, a substrate handler positioned below the substrate carriage is both magnetically coupled and magnetically levitated, providing further particle reduction.Type: GrantFiled: March 29, 2000Date of Patent: October 22, 2002Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Alexey Goder, Eugene Gantvarg, Howard E. Grunes
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Publication number: 20020111710Abstract: A multiple substrate orienter is provided that includes a rotatable substrate handler having a plurality of substrate support portions, each adapted to support a substrate. The multiple substrate orienter also includes a plurality of stacked substrate supports, each adapted to support a substrate. A plurality of substrate orientation marking (SOM) detectors are provided, and each SOM detector is coupled to a different one of the substrate supports and is adapted to identify a presence of an SOM of a substrate positioned close enough to the SOM detector to allow SOM detection by the SOM detector. The multiple substrate orienter further includes a plurality of lift and lower mechanisms, each lift and lower mechanism coupled to a different one of the substrate supports and adapted to individually lift and lower the substrate support to which the lift and lower mechanism is coupled. Numerous other aspects are provided.Type: ApplicationFiled: April 8, 2002Publication date: August 15, 2002Applicant: Applied Materials, Inc.Inventors: Ilya Perlov, Eugene Gantvarg, Leonid Tertitski
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Patent number: 6393337Abstract: A multiple substrate orienter is provided that includes a rotatable substrate handler having a plurality of substrate support portions, each adapted to support a substrate. The multiple substrate orienter also includes a plurality of stacked substrate supports, each adapted to support a substrate. A plurality of substrate orientation marking (SOM) detectors are provided, and each SOM detector is coupled to a different one of the substrate supports and is adapted to identify a presence of an SOM of a substrate positioned close enough to the SOM detector to allow SOM detection by the SOM detector. The multiple substrate orienter further includes a plurality of lift and lower mechanisms, each lift and lower mechanism coupled to a different one of the substrate supports and adapted to individually lift and lower the substrate support to which the lift and lower mechanism is coupled.Type: GrantFiled: January 13, 2000Date of Patent: May 21, 2002Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Eugene Gantvarg, Leonid Tertitski