Abstract: The present disclosure relates to systems and methods of protecting intellectual property and, more particularly to systems and methods of disabling electronic or software components. The system includes: a measurement component provided with an enclosure, which measures environmental conditions within the enclosure; and a countermeasure component provided with the enclosure, which renders inoperative at least one electronic or software component within the enclosure when the measurement component detects that the conditions within the enclosure have changed beyond a predetermined amount.

Abstract: In some embodiments, flat electrical contact pads may be fabricated along a routed edge face of a printed wiring board (PWB). Some embodiments of the edge pads may, for example, be perpendicular to a plane of the printed wiring board. In some embodiments, the edge pads may be of a specified length and/or width. Some embodiments of the edge pads may, for example, have a surface finish suitable for soldering and/or for direct contact interconnections. In some embodiments, the edge pads may, for example, be configured for electrical connection to an adjoining device (e.g., PWB) with mating pads to form a tiled array configuration of interconnected devices (e.g., PWBs).

Abstract: A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.

Abstract: A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.

Abstract: A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to center line distances equals the connector offset on a given backplane. Direct connections to both boards of the dual-board structure can thus be made from the backplane to reduce connection length and reliability relating to a mezzanine board mounted on a single-board host.