Patents by Inventor Eugene Kai Poh Wong

Eugene Kai Poh Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Panel level methods and systems for packaging integrated circuits with integrated heat sinks
    Patent number: 7998791
    Abstract: Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: August 16, 2011
    Assignee: National Semiconductor Corporation
    Inventors: Sek Hoi Chong, Shee Min Yeong, Danny Cher Hau Koh, Eugene Kai Poh Wong
  • PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH INTEGRATED HEAT SINKS
    Publication number: 20090194868
    Abstract: Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 6, 2009
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Sek Hoi CHONG, Shee Min YEONG, Danny Cher Hau KOH, Eugene Kai Poh WONG